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The AirBorn VSF-05-50-50-04-N1 is a rectangular military specification connector from the VerSI VSF series, manufactured by Molex/AirBorn. It functions as a receptacle featuring 250 positions arranged in a 5-row configuration with a 0.050-inch (1.27mm) pitch. The component utilizes press-fit termination for board mounting and includes fixed jacknuts compatible with board thicknesses between 0.125 and 0.250 inches. Constructed with a plastic body and gold-plated female sockets, it provides high-density interconnect capabilities for demanding applications.
Verify exact part number alignment when sourcing, as suffixes denote critical physical attributes such as termination style and housing material. Confirm that the fixed jacknut design matches your panel or board thickness requirements to ensure proper installation. Cross-reference manufacturer documentation to validate compliance with current environmental standards and material specifications before finalizing procurement orders.
Select this component when high pin count density is required within strict spatial constraints. The press-fit termination eliminates soldering processes, potentially improving assembly speed and consistency. Ensure the mating plug supports the same 0.050-inch pitch and row configuration to maintain signal integrity and mechanical compatibility in the final assembly design.
This connector belongs to the AirBorn VerSI VSF series, which specializes in high-reliability rectangular connectors for harsh environments. The series is known for combining robust mechanical performance with high circuit density. As a product of Molex/AirBorn, it adheres to rigorous military specifications, ensuring durability against vibration, shock, and extreme temperatures common in defense and aerospace sectors.
Direct substitutes must match the 250-position count, 5-row layout, and 0.050-inch pitch. Verify that any replacement also uses press-fit termination and compatible jacknut dimensions. Generic equivalents may lack the specific MIL-spec certification or environmental sealing required for original application scenarios.