VSF-06-50-50-06-L1

Overview

The AirBorn VSF-06-50-50-06-L1 is a high-speed rectangular connector receptacle featuring 300 positions arranged in 6 rows and 50 columns. It utilizes through-hole termination with gold-plated copper alloy contacts housed in liquid crystal polymer (LCP). The component supports a maximum operating temperature of +125°C and provides reliable signal integrity for demanding electronic applications.

Feature Summary

• High-density interconnect capability with 300 circuits in a compact form factor
• Gold-plated contacts ensure corrosion resistance and stable electrical performance
• Liquid crystal polymer housing offers thermal stability and mechanical strength

Applications

• High-speed data transmission systems
• Military and aerospace avionics
• Industrial control boards requiring robust connectivity

Procurement Notes

Verify the specific suffix L1 against official Molex/AirBorn documentation to confirm pin configuration and plating specifications. Ensure compatibility with mating plug series before procurement, as minor variations exist within the Versi family.

Selection Notes

Select this part when high pin count density and through-hole mounting are required. Confirm that the board thickness and hole dimensions accommodate the specified contact geometry. Verify thermal requirements align with the +125°C rating.

Part Context

This component belongs to the AirBorn Versi series, designed for high-reliability interconnects. It serves as a receptacle counterpart to matching plugs, facilitating secure board-to-board or cable-to-board connections in rugged environments.

Replacement Considerations

Cross-reference with VSF-06-50-50-06-G1 for press-fit variants or other suffixes indicating different termination methods. Verify mechanical fit and electrical ratings before substituting.