VSF-08-30-50-06-N1

Overview

The VSF-08-30-50-06-N1 is a high-speed board-to-board and mezzanine connector receptacle from the AirBorn verSI series. It features female sockets with through-hole termination and a straight mounting style. The component utilizes gold-plated copper alloy contacts housed in a liquid crystal polymer (LCP) body. It supports a current rating of 2 A and a voltage rating of 200 V, operating within a temperature range of -55°C to +125°C.

Feature Summary

• High-speed signal transmission capability for demanding electronic applications
• Robust construction using liquid crystal polymer housing material
• Gold-plated copper alloy contacts ensuring reliable electrical connectivity

Applications

• Board-to-board interconnections
• Mezzanine circuit mounting
• High-density electronic assemblies

Procurement Notes

Verify the specific pin count and contact configuration against official datasheets before procurement. Confirm that the through-hole termination and straight mounting orientation match the target PCB layout requirements. Ensure environmental ratings meet operational standards.

Selection Notes

Select this component for applications requiring high-speed data transfer in compact spaces. Consider the LCP material properties for thermal stability. Evaluate the 2 A current rating against load requirements. Verify compatibility with mating connectors in the verSI family.

Part Context

This part belongs to the AirBorn verSI series, which offers vertical and right-angle board-mount options. The series provides configurations ranging from 40 to 500 contacts, supporting various I/O needs including cable and flex-circuit mounting solutions.

Replacement Considerations

Consult official substitution guides for compatible alternatives. Verify mechanical dimensions and electrical characteristics match exactly when considering cross-references.