VSF-08-40-50-00-N

Overview

The AirBorn VSF-08-40-50-00-N is a rectangular military specification receptacle from the verSI series. It features a 1.27 mm (0.050 inch) pitch with a plastic body and vertical press-fit termination. The connector provides 320 positions arranged in 8 rows and 40 columns. It utilizes gold-plated female socket contacts and complies with MIL-DTL-83513 standards.

Feature Summary

• Vertical board mount design with press-fit termination for secure PCB integration
• Gold-plated female socket contacts ensuring reliable signal transmission
• Compliance with MIL-DTL-83513 military specification requirements

Applications

• Military and defense electronic systems
• High-reliability aerospace interconnects
• Board-to-board stacking applications requiring robust mechanical retention

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm contact plating thickness and material composition. Ensure compatibility with mating plug assemblies regarding row and column counts. Confirm that the press-fit termination style aligns with the target printed circuit board manufacturing capabilities and hole specifications.

Selection Notes

Select this component when a high-density, vertically mounted receptacle is required for rugged environments. The 1.27 mm pitch supports dense circuit layouts while maintaining signal integrity. Verify that the 320-position capacity meets system requirements and that the MIL-DTL-83513 compliance satisfies project qualification standards.

Part Context

This part belongs to the AirBorn verSI series of rectangular connectors, designed for demanding applications. The series offers various termination options and configurations to support diverse board stacking and interconnect needs within military and industrial sectors.

Replacement Considerations

Cross-reference with other verSI series receptacles sharing identical row, column, and termination specifications. Ensure any substitute maintains the same MIL-DTL-83513 certification and physical footprint constraints.