VSF-08-40-50-03-L

Overview

The AirBorn VSF-08-40-50-03-L is a rectangular military specification receptacle from the verSI series. It features an 8-row configuration with 40 columns, providing 320 positions. The connector utilizes a 1.27 mm pitch and employs a solder pin termination style for board mounting. Constructed with a liquid crystal polymer body and copper alloy contacts plated with gold, it supports a current rating of 2 A and a voltage rating of 200 V. The unit operates within a temperature range of -55 °C to +125 °C.

Feature Summary

• Military specification compliance ensuring reliability in demanding environments
• High-density interconnect capability through multi-row architecture
• Secure mechanical attachment via solder pin termination

Applications

• Board-to-board connectivity systems
• Mezzanine interface assemblies
• Vertical PCB mounting applications

Procurement Notes

Verify the specific ordering suffix against official Molex/AirBorn documentation to confirm exact termination and housing variations. Confirm RoHS compliance status and environmental certifications prior to integration. Ensure compatibility with mating plug components within the same verSI series family. Validate that the selected variant meets all required thermal and electrical specifications for the target application environment.

Selection Notes

Select this component when high-density vertical interconnection is required for military or industrial standards. The 1.27 mm pitch allows for compact circuit board layouts while maintaining signal integrity. Verify that the 2 A current rating and 200 V voltage limits align with system requirements. Consider the operating temperature range and material compatibility with adjacent assembly components during the design phase.

Part Context

This part belongs to the AirBorn verSI series, designed for high-reliability electronic interconnections. The series offers various configurations to support diverse board stacking and mezzanine needs. As a receptacle, it pairs with corresponding plugs to establish robust electrical pathways in complex electronic architectures.

Replacement Considerations

Consult official cross-reference guides for compatible alternatives. Verify that any substitute maintains identical pin counts, pitch dimensions, and termination styles to ensure mechanical fit and electrical continuity without redesigning the host assembly.