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The AirBorn VSF-08-50-50-06-L1 is a rectangular MIL-Spec connector from the verSI series, manufactured by Molex/AirBorn. It features a 400-position configuration with 8 rows and 50 columns. The component utilizes a 1.27 mm (0.050 inch) pitch and employs gold-plated phosphor bronze contacts housed in a liquid crystal polymer (LCP) body. Designed for vertical through-hole board mounting, it operates within a temperature range of -55°C to +125°C and carries an MIL-DTL-83513 classification.
Verify the specific ordering suffix against the manufacturer's current datasheet to ensure correct termination style and mounting hardware compatibility. Confirm RoHS status and lead times directly with authorized distributors, as availability may vary. Ensure the selected variant matches the required pin or socket orientation for your assembly design.
Select this component when high I/O density is required in space-constrained military applications. The 1.27 mm pitch allows for significant signal routing in a small footprint. Verify that the through-hole mounting style aligns with the PCB fabrication capabilities and that the LCP material properties meet the thermal requirements of the operating environment.
This part belongs to the AirBorn verSI series, which is designed for high-performance rectangular interconnects. The series is widely recognized in defense and aerospace sectors for its reliability under harsh conditions. The VSF designation indicates a receptacle configuration within this standardized product line.
Direct substitutes must match the 400-position count, 8-row layout, and 1.27 mm pitch. Verify mechanical dimensions and MIL-DTL-83513 compliance before substitution. Cross-reference with other manufacturers offering equivalent rectangular MIL-spec connectors if AirBorn supply is unavailable.