VSF-10-10-50-03-L

Overview

The VSF-10-10-50-03-L is a board-to-board and mezzanine connector from the AirBorn verSI series, manufactured by Molex. It features a straight receptacle design with solder pin termination for secure PCB mounting. The component provides 50 positions arranged in a single row, utilizing a 1.27 mm pitch. Electrical ratings include a current capacity of 2 A and a voltage rating of 200 V. The contacts are constructed from copper alloy with gold plating, while the housing is made of liquid crystal polymer (LCP). The unit operates within a temperature range of -55 C to +125 C.

Feature Summary

• Straight board-to-board and mezzanine architecture designed for vertical interconnection
• Solder pin termination style ensures reliable surface mount or through-hole integration
• Gold-plated copper alloy contacts provide durable conductive pathways
• Liquid crystal polymer housing offers structural stability and thermal resistance

Applications

• High-density electronic module interconnections
• Vertical board stacking configurations
• Mezzanine card interface systems

Procurement Notes

Verify the specific manufacturer part number against official Molex / AirBorn documentation to confirm compatibility with your design requirements. Ensure that the solder pin termination and straight orientation match your PCB layout constraints. Cross-reference the electrical ratings and material specifications with your system's operational standards before finalizing procurement decisions.

Selection Notes

Select this component when a straight, high-density interconnect solution is required for board-to-board applications. The 1.27 mm pitch supports compact designs, while the 200 V rating accommodates moderate voltage levels. Consider the solder pin termination method for permanent assembly and verify that the operating temperature range meets your environmental conditions.

Part Context

This connector belongs to the AirBorn verSI series, which specializes in rectangular military specification and high-reliability interconnect solutions. The series offers various configurations including different row counts, board spacings, and termination styles to support diverse electronic packaging needs across defense, aerospace, and industrial sectors.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Molex / AirBorn resources for compatible alternatives or cross-reference data.