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The VSF-10-20-50-03-N is a rectangular military specification connector from the AirBorn verSI series, manufactured by Molex. It functions as a board-to-board and mezzanine receptacle with a 0.050-inch (1.27mm) pitch. The component features a liquid crystal polymer (LCP) housing and gold-plated copper alloy contacts. Designed for vertical through-hole mounting, it supports up to +125°C operating temperatures and complies with MIL-DTL-83513 standards.
Verify the specific datasheet version and environmental compliance status directly with Molex or authorized distributors before procurement. Confirm that the LCP housing material and gold plating specifications match the design requirements. Ensure the vertical through-hole mounting style aligns with the target PCB layout and mechanical constraints.
Select this component when a high-density, vertical mezzanine connection is required within the verSI series. The 0.050-inch pitch allows for compact board designs. Consider the LCP housing material for environments requiring thermal resistance. Verify compatibility with mating plugs in the same series to ensure proper interface alignment and electrical performance.
This part belongs to the AirBorn verSI family of rectangular connectors, which are widely used in rugged environments. The series is known for its high I/O density and reliability under harsh conditions. As a Molex product, it adheres to strict quality standards for defense and industrial applications.
The contacts are made of copper alloy with gold plating.
Yes, the verSI series is designed to meet MIL-DTL-83513 specifications.