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The AirBorn VSF-10-20-50-06-L1 is a high-density, board-to-board connector system designed for demanding electronic applications. It features a vertical mating configuration with a 0.8mm pitch and dual rows of contacts to maximize I/O density within constrained PCB footprints. The assembly utilizes gold-plated phosphor bronze contacts housed in a thermoplastic insulator, ensuring reliable signal transmission and mechanical stability under vibration and thermal cycling conditions.
Verify the specific termination style (press-fit vs. SMT) and housing material compatibility with your PCB fabrication process. Confirm that the selected variant matches the required current rating and environmental specifications for your target application environment before finalizing procurement orders.
Evaluate the available pin counts and row configurations to ensure adequate I/O capacity for your circuit design. Consider the mating height and clearance requirements relative to adjacent components on the PCB to prevent mechanical interference during assembly and operation.
This component belongs to AirBorn's VSF series, which specializes in high-performance board-to-board connections. The series is engineered for applications requiring superior signal integrity and durability in harsh environments, distinguishing it from standard commercial-grade connectors through rigorous testing and material selection.
Direct substitutes are limited due to proprietary housing geometries. Verify pinout compatibility and mechanical dimensions if considering alternative vendors. Consult manufacturer cross-reference guides for approved equivalents that meet identical electrical and mechanical specifications.
The connector features a 0.8mm pitch between adjacent contacts.
Yes, the design includes robust locking mechanisms and secure termination methods to withstand significant vibration and shock.