VSF-10-50-50-06-L1

Overview

The VSF-10-50-50-06-L1 is a board-to-board and mezzanine connector from the AirBorn verSI series, manufactured by Molex. It features a receptacle design with solder pin termination for secure PCB mounting. The component supports a straight installation angle and utilizes gold-plated copper alloy contacts to ensure reliable signal transmission. Constructed with a liquid crystal polymer (LCP) housing, it offers high thermal stability and mechanical durability. This connector is rated for 2 A current and 200 V voltage, operating within a temperature range of -55°C to +125°C.

Feature Summary

• High-density interconnect solution designed for vertical board stacking applications
• Gold-plated contacts provide corrosion resistance and stable electrical performance
• Liquid crystal polymer housing ensures dimensional stability under thermal stress

Applications

• Military and aerospace electronic systems requiring MIL-Spec reliability
• High-density server backplanes and mezzanine card interfaces
• Avionics control units demanding robust vibration resistance

Procurement Notes

Verify specific ordering requirements directly with the manufacturer, as this item may be classified as a factory special order. Confirm RoHS compliance status through official documentation before integration. Ensure that the selected variant matches the required contact configuration and housing material specifications for your application environment.

Selection Notes

Select this component when high-density vertical interconnection is required in constrained spaces. The straight orientation and solder pin termination suit automated assembly processes. Evaluate the 2 A current rating against peak load requirements. The LCP material choice supports high-temperature reflow soldering profiles without deformation.

Part Context

This part belongs to the AirBorn verSI series, known for compact form factors and high reliability in harsh environments. As a product of Molex / AirBorn, it adheres to stringent military specifications. The series emphasizes miniaturization while maintaining robust mechanical locking and electrical continuity standards for critical infrastructure.

Replacement Considerations

Cross-reference with other verSI series variants for position count adjustments. Verify compatibility with mating header components from the same family. Check for updated PCNs regarding material changes or manufacturing site transfers.