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The VSM-04-20-200-50-06-N1 is a rectangular MIL-Spec connector plug from the AirBorn verSI series, manufactured by Molex. It features a 0.050-inch (1.27 mm) pitch with a plastic body and vertical orientation. The component utilizes press-fit termination for board mounting and includes fixed jacknuts to accommodate board thicknesses up to 0.250 inches. This specific part number provides 200 positions arranged in six rows and twenty columns, supporting 200 circuits. Contact materials consist of phosphor bronze with gold plating, ensuring reliable signal transmission within military-grade specifications.
Verify the current manufacturing status directly with Molex or authorized distributors, as this item may be classified as a factory special order. Confirm that the required fixed jacknut configuration matches the target assembly's mechanical constraints. Ensure compatibility with existing MIL-DTL-83513 mating receptacles before finalizing procurement orders to prevent integration errors.
Select this variant when a six-row configuration is necessary to maximize circuit density within a constrained footprint. The press-fit termination method is appropriate for applications prioritizing mechanical retention over frequent insertion cycles. Verify that the 0.050-inch pitch aligns with the available PCB trace spacing requirements and that the vertical orientation fits within the designated enclosure height limits.
This component belongs to the AirBorn verSI series, which represents a line of high-performance rectangular connectors designed for demanding environments. The series is characterized by its compliance with stringent military specifications and its use in critical mission-critical applications. Integration into the Molex portfolio maintains the original engineering specifications while leveraging expanded global supply chain resources.
Direct substitutes must match the 200-position count, six-row layout, and press-fit termination style. Verify that any alternative part number retains the same MIL-DTL-83513 certification and physical dimensions to ensure interchangeability without modifying the host board design.