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The VSM-04-30-080-50-06-L1 is a vertical male board stacking connector from the AirBorn verSI series, manufactured by Molex. It features a 1.27 mm pitch and is configured with 4 rows and 30 columns, providing 120 positions. The unit utilizes gold-plated phosphor bronze contacts housed in a liquid crystal polymer (LCP) body. Designed for through-hole termination, it supports a maximum board spacing of 8 mm and operates within a temperature range of -55 °C to +125 °C. Rated at 2 A and 200 V, this MIL-DTL-83513 compliant component ensures reliable signal integrity in high-density PCB applications.
Verify the specific termination style suffix against official documentation, as variations exist within the series. Confirm compliance requirements such as RoHS status directly with the manufacturer or authorized distributors before procurement. Ensure the selected part matches the required board thickness and spacing specifications for your design.
Select this component when a vertical male interface is required for board-to-board connections. Verify that the 1.27 mm pitch and 120-position configuration align with your layout constraints. Ensure the operating environment falls within the specified temperature range and that the through-hole termination method is compatible with your manufacturing process.
This component belongs to the AirBorn verSI series, which specializes in rectangular military specification connectors. The series offers various row and column configurations to accommodate different density requirements while maintaining consistent 1.27 mm pitch dimensions across the product line.
Consult official cross-reference data for verified substitutes. Generic equivalents may not match the specific MIL-DTL-83513 compliance or dimensional tolerances required for this application.