SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AirBorn VSM-05-20-100-50-06-L1 is a high-density rectangular connector assembly designed for demanding electronic environments. It features a 5-row configuration with 20 contacts per row, totaling 100 positions. The connector utilizes a 0.100-inch (2.54 mm) centerline pitch to maximize I/O density within constrained panel spaces. This specific model incorporates a 50-mil board thickness compatibility and includes a low-profile design optimized for vertical mating applications.
Verify the complete part number against official AirBorn documentation to ensure correct housing, contact type, and termination style specifications. Confirm that the required ordering suffixes match the exact environmental rating and plating requirements for your specific application before finalizing procurement orders.
Select this component when high I/O density is critical in a limited footprint. Ensure the mating connector series matches the VSM family specifications. Verify board thickness tolerance and mounting hole patterns align with the system chassis design constraints prior to integration.
This part belongs to the AirBorn VSM series of rectangular connectors, known for their rugged construction and high reliability. The series is widely utilized in sectors requiring dependable performance under harsh conditions, including defense and transportation applications where vibration resistance and signal integrity are paramount.
Consult official AirBorn cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pin count, pitch, and mounting configuration to guarantee mechanical and electrical compatibility within the existing assembly.