VSM-06-20-100-50-03-N

Overview

The VSM-06-20-100-50-03-N is a rectangular military specification connector from the AirBorn verSI series. It features a plastic body with vertical through-hole termination and straight mounting style. The component provides 120 positions arranged in 6 rows, utilizing male pin contacts with gold plating. Key specifications include a 1.27 mm pitch, 10.00 mm board spacing, and a 0.109 inch tail length. It supports a maximum board thickness of 0.125 inches and operates within a temperature range of -55°C to +125°C.

Feature Summary

• Complies with MIL-DTL-83513 standards for rugged military applications
• Utilizes Liquid Crystal Polymer (LCP) housing for thermal stability
• Features fixed jacknuts for secure board attachment

Applications

• High-density electronic interconnects
• Military avionics systems
• Ruggedized communication equipment

Procurement Notes

Verify the specific suffix 'N' against official Molex/AirBorn documentation to confirm material composition and environmental ratings. Ensure compatibility with mating receptacles such as the VSF series. Confirm that the 10.00 mm board spacing aligns with your PCB stack-up requirements before finalizing procurement.

Selection Notes

Select this part when a high-pin-count, vertically mounted connector is required for MIL-Spec environments. The 120-position configuration suits dense signal routing. Verify that the 0.109 inch tail length accommodates your soldering process and board thickness constraints relative to the 0.125 inch maximum limit.

Part Context

This component belongs to the AirBorn verSI family, designed for demanding interface applications. The VSM prefix indicates a vertical plug configuration. The series is characterized by its small form factor and robust construction, suitable for space-constrained military and aerospace deployments requiring reliable connectivity.

Replacement Considerations

Compatible mating receptacles include the VSF-06-20-100-50-03-N. Verify mechanical fit and electrical continuity with existing system designs before substitution.