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VUM25-05E is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists IXYS. Its product description is BRIDGE RECT 3P 600V 40A V1A-PAK. Review the specifications below when checking this part for your BOM.
The VUM25-05E is a rectifier module designed for three-phase power factor correction, integrating fast recovery epitaxial diodes with MOSFETs. It utilizes the HDMOSTM process to achieve low on-resistance and package inductance for high-speed switching. The component features a DCB ceramic base plate and soldering connections for PCB mounting, providing an isolation voltage of 3600 Vrms. This configuration supports wide input voltage ranges and eliminates the need for external isolation components.
Verify the specific datasheet revision and RoHS compliance status directly from the manufacturer before procurement. Confirm that the required isolation voltage rating of 3600 Vrms aligns with the target circuit design requirements. Ensure the PCB layout accommodates the specified soldering connections and mounting screw positions for proper thermal and electrical performance.
Select this module when designing three-phase systems requiring integrated PFC functionality. The combination of HDMOSTM MOSFETs and ultrafast diodes makes it suitable for applications demanding reduced harmonic content. Consider the thermal characteristics provided by the DCB ceramic base plate for heat dissipation needs in compact enclosures.
This component belongs to the VUM series of rectifier modules manufactured by IXYS Corporation. These modules are engineered specifically for power factor correction stages in industrial electronics. The integration of active switches and rectifiers within a single package simplifies the bill of materials and reduces assembly complexity compared to discrete solutions.
The VUM24-05N is documented as a similar part number within the same product family. Verify functional equivalence regarding voltage ratings and current handling capabilities before substitution. Cross-reference pinouts and thermal specifications to ensure compatibility with existing board layouts.
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