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VWO95-12IO7 is listed in the SCRs - Modules range at ChipApex. The manufacturer field lists IXYS. Its product description is MODULE AC CTLR 3PH 1200V PWS-F. Review the specifications below when checking this part for your BOM.
The IXYS VWO95-12IO7 is a three-phase AC controller module designed for mains frequency applications. It integrates thyristors and diodes in a single package with an insulated metal base plate. The device supports an RMS current of 96 A per phase at 85°C and offers a repetitive peak reverse voltage of 1200 V. Key electrical parameters include a maximum junction temperature of 125°C, a non-repetitive surge current of 1150 A, and an isolation voltage of 3000 Vrms. Thermal resistance from junction to case is rated at 0.66 K/W per thyristor.
Verify the specific ordering suffix against official datasheets to confirm voltage ratings and pin configurations. Ensure thermal management solutions match the specified junction-to-case thermal resistance values. Confirm that gate drive requirements align with the stated trigger current and voltage limits before integration into the final design.
Select this module for high-power density applications requiring integrated three-phase control. Consider the 96 A RMS rating and 1200 V blocking capability when sizing for industrial loads. Evaluate the thermal performance characteristics to ensure adequate heat sinking meets the 125°C maximum junction temperature constraint under continuous operating conditions.
This component belongs to the VWO series of three-phase AC controller modules manufactured by IXYS. The series provides compact solutions for power electronics by combining multiple semiconductor devices into a single screw-mountable unit. These modules are engineered for robust operation in demanding industrial environments where space constraints and thermal efficiency are critical design factors.
Cross-reference with other VWO95 variants such as VWO95-08IO7 or VWO95-14IO7 if different voltage ratings are required. Verify mechanical dimensions and mounting hole patterns to ensure compatibility with existing PCB layouts and heatsink interfaces without redesigning the assembly structure.
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