Memory IC W25M02GVTBJR product image

W25M02GVTBJR

  • Description:IC FLASH 2GBIT SPI/QUAD 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:d3a30313fff1 Category: Brand:

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W25M02GVTBJR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 2GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25M02GVTBJR

  • Description:IC FLASH 2GBIT SPI/QUAD 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:700µs
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (8x6)
  • Access Time:7 ns

Memory IC datasheet and documents for W25M02GVTBJR

W25M02GVTBJR

Memory IC Overview

The W25M02GVTBJR is a 2 Gbit (2 x 1 Gbit) Serial MCP Flash memory from the W25M02GV series. It utilizes a TFBGA-24 package and operates on a single 2.7V to 3.6V supply. The device supports Standard, Dual, and Quad SPI interfaces with clock frequencies up to 104 MHz. It features Concurrent Operations for independent die access and Continuous Read Mode for efficient array access.

Memory IC Feature Summary

  • Supports Concurrent Operations allowing independent single die access and simultaneous read while program/erase cycles occur.
  • Enables Efficient Continuous Read Mode for direct access to the entire memory array without issuing page data read commands between reads.
  • Provides Flexible Architecture with 128KB uniform block erase capabilities and user-configurable internal ECC.
  • Includes Advanced Features such as bad block management, software/hardware write protection, and OTP pages.

Memory IC Applications

  • Small form factor system designs requiring high density in low pin-count packages
  • Applications demanding high Program/Erase data throughput
  • Code shadowing applications utilizing Continuous Read Mode

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm voltage range and package type. Ensure compatibility with the required SPI interface mode and operating temperature specifications before procurement.

Memory IC Selection Notes

Select this component for designs needing high memory density within space-constrained footprints. Consider the W25M02GV series for its ability to handle concurrent operations and high-speed data transfer rates suitable for performance-critical embedded systems.

Memory IC Part Context

This part belongs to the W25M SpiStack® series, which stacks two individual W25N01GV dies into a standard package. It represents an evolution of the W25N Serial SLC NAND SpiFlash® family, offering improved manageability through integrated ECC and bad block management features.

Memory IC Replacement Considerations

Consult the manufacturer's cross-reference tool for parametrically similar parts. Verify that any substitute supports the same TFBGA-24 package and 2.7V-3.6V operating voltage range.

W25M02GVTBJRW25M02GVTBJR

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