W25M161AVEIT

Description：IC FLASH 16MBIT SPI/QUAD 8WSON
Series：SpiFlash®
Mfr：Winbond Electronics
Package：Tray

SKU:79233e42476b Category: Memory IC Brand: Winbond Electronics

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Product introduction

W25M161AVEIT is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 16MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25M161AVEIT

Description：IC FLASH 16MBIT SPI/QUAD 8WSON
Series：SpiFlash®
Mfr：Winbond Electronics
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND, FLASH - NOR
Memory Size：16Mbit (FLASH-NOR), 1Gbit (FLASH-NAND)
Memory Organization：2M x 8 (FLASH-NOR), 128M x 8 (FLASH-NAND)
Memory Interface：SPI - Quad I/O
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：3ms
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：8-WDFN Exposed Pad
Supplier Device Package：8-WSON (8x6)
Access Time：6 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for W25M161AVEIT

W25M161AVEIT

Memory IC Overview

The W25M161AVEIT is a serial Multi-Chip Package (MCP) flash memory from Winbond, integrating a 16M-bit Serial NOR Flash and a 1G-bit Serial NAND Flash within an 8-pad WSON 8x6-mm package. It operates on a single 2.7V to 3.6V supply and supports Standard, Dual, and Quad SPI interfaces. The device utilizes the SpiStack® architecture with factory-assigned Die IDs for independent access via Software Die Select instructions.

Memory IC Feature Summary

Integrates 16M-bit NOR and 1G-bit NAND memories in a compact 8-pin package
Supports concurrent read and program/erase operations across stacked dies
Enables independent die selection through Software Die Select instruction
Provides flexible sector and block erase architectures for data storage

Memory IC Applications

Small form factor system designs requiring high density
Applications demanding high program and erase data throughput
Systems needing combined code execution and large data storage

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to ensure correct temperature range and package type. Confirm availability status directly with authorized distributors as stock levels fluctuate. Ensure the design accommodates the 8-pad WSON footprint and shared SPI interface requirements for proper integration.

Memory IC Selection Notes

Select this component when space constraints necessitate combining NOR and NAND capabilities in a single package. It is suitable for designs requiring simultaneous code execution and bulk data storage without increasing pin count. Consider the SpiStack® control logic required for die selection and concurrent operation management during hardware design.

Memory IC Part Context

This part belongs to the W25M SpiStack® series, which stacks W25Q16JV and W25N01GV dies. It maintains standard SpiFlash features while introducing multi-die concurrency. The industrial temperature variant (-40°C to +85°C) ensures reliability in diverse operating environments.