W25N02JWTBIC

Memory IC Overview

The W25N02JWTBIC is a 2 Gbit Serial NAND Flash memory device manufactured by Winbond Electronics. It operates on a single 1.8V power supply and utilizes a Quad SPI interface for data communication. The component is housed in a 24-pin TFBGA package, designed for surface-mount technology applications. It supports standard SPI commands and offers high-density storage suitable for embedded systems requiring non-volatile data retention.

Memory IC Feature Summary

• Integrates 2 Gbit of SLC NAND flash memory capacity within a compact footprint.
• Supports Quad SPI interface for high-speed data transfer operations.
• Operates reliably under industrial temperature ranges with low voltage requirements.

Memory IC Applications

• Embedded systems requiring code shadowing to RAM
• Storage for voice, text, and data in IoT devices
• XIP (Execute In Place) applications via direct SPI access

Memory IC Procurement Notes

Verify the specific suffix 'C' against official Winbond documentation to confirm package variant or tape/reel specifications. Ensure compatibility with existing PCB footprints for the 24-TFBGA configuration. Confirm RoHS compliance status through current manufacturer certificates before final procurement integration.

Memory IC Selection Notes

Select this component when a 2 Gbit density is required with a 1.8V operating voltage constraint. The TFBGA-24 package is suitable for space-constrained designs. Compare against the W25N02K series if a 3.3V supply is available, as it may offer different thermal or availability characteristics.

Memory IC Part Context

This part belongs to the Winbond W25N02JW series of Serial NAND Flash memories. It shares architectural similarities with other members like the W25N02KV but differs in supply voltage and package options. The series is designed to replace parallel NAND or eMMC solutions in cost-sensitive and space-limited embedded applications.

Memory IC Replacement Considerations

Consider the W25N02KWTBIR for equivalent 2 Gbit capacity if 3.3V operation is acceptable. Verify pinout compatibility between TFBGA variants before substitution. Cross-reference datasheets for timing differences between 1.8V and 3.3V families.