Memory IC W25N02KVTBIU product image

W25N02KVTBIU

$3.07
  • Description:IC FLASH 2GBIT SPI/QUAD 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:26a9a87ac79a Category: Brand:

  
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W25N02KVTBIU is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 2GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25N02KVTBIU

  • Description:IC FLASH 2GBIT SPI/QUAD 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:700µs
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (8x6)
  • Access Time:7 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W25N02KVTBIU

W25N02KVTBIU

Memory IC Overview

The Winbond W25N02KVTBIU is a 2G-bit Single-Level Cell (SLC) QspiNAND Flash Memory device. It operates on a single 2.7V to 3.6V power supply and supports standard, dual, and quad SPI interfaces with clock frequencies up to 104MHz. The memory array consists of 131,072 programmable pages of 2,048 bytes each, organized into 2,048 erasable blocks of 128KB. The component is housed in a 24-ball TFBGA package measuring 8x6 mm.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI interfaces for flexible data transfer modes
  • Includes an internal 8-bit ECC engine with configurable status reporting
  • Provides hardware and software write protection mechanisms via dedicated pins and registers
  • Features sequential read mode for efficient access to the entire memory array

Memory IC Applications

  • Code shadowing to RAM
  • Execute-in-place (XIP) applications using Dual/Quad SPI
  • Storage of voice, text, and general data

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature range and 'U' denotes the TFBGA package configuration. Confirm moisture sensitivity level requirements and reflow soldering profiles during assembly. Ensure the host system supports the required voltage levels and SPI command set compatibility before integration.

Memory IC Selection Notes

Select this component when a high-density NAND solution is required within a small footprint. It is suitable for designs needing low power consumption and robust data integrity features like ECC. Consider the TFBGA package constraints and ensure the PCB layout accommodates the 24-ball array dimensions.

Memory IC Part Context

This part belongs to the W25N QspiNAND family, which combines SPI interface simplicity with NAND flash capacity. The W25N02KV variant specifically offers 2G-bit density. The 'TBIU' designation corresponds to the TFBGA package and industrial temperature grade, distinguishing it from other packaging or commercial grade options.

Memory IC Replacement Considerations

W25N02KVTBIG TR

Memory IC FAQ

What is the function of the /WP pin?

The /WP pin provides hardware write protection. When configured correctly, tying it to ground disables all write, program, and erase functions, making the device read-only.

How does the Sequential Read Mode work?

Sequential Read Mode allows efficient access to the entire memory array with a single read command, eliminating the need for multiple address updates during large data transfers.

W25N02KVTBIUW25N02KVTBIU
$3.07
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