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W25N02KVTBIU is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 2GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
The Winbond W25N02KVTBIU is a 2G-bit Single-Level Cell (SLC) QspiNAND Flash Memory device. It operates on a single 2.7V to 3.6V power supply and supports standard, dual, and quad SPI interfaces with clock frequencies up to 104MHz. The memory array consists of 131,072 programmable pages of 2,048 bytes each, organized into 2,048 erasable blocks of 128KB. The component is housed in a 24-ball TFBGA package measuring 8x6 mm.
Verify the specific suffix 'I' indicates industrial temperature range and 'U' denotes the TFBGA package configuration. Confirm moisture sensitivity level requirements and reflow soldering profiles during assembly. Ensure the host system supports the required voltage levels and SPI command set compatibility before integration.
Select this component when a high-density NAND solution is required within a small footprint. It is suitable for designs needing low power consumption and robust data integrity features like ECC. Consider the TFBGA package constraints and ensure the PCB layout accommodates the 24-ball array dimensions.
This part belongs to the W25N QspiNAND family, which combines SPI interface simplicity with NAND flash capacity. The W25N02KV variant specifically offers 2G-bit density. The 'TBIU' designation corresponds to the TFBGA package and industrial temperature grade, distinguishing it from other packaging or commercial grade options.
W25N02KVTBIG TR
The /WP pin provides hardware write protection. When configured correctly, tying it to ground disables all write, program, and erase functions, making the device read-only.
Sequential Read Mode allows efficient access to the entire memory array with a single read command, eliminating the need for multiple address updates during large data transfers.
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