Memory IC W25N04KVTCIR TR product image

W25N04KVTCIR TR

  • Description:IC FLASH 4GBIT SPI/QUAD 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:5708364bc4c4 Category: Brand:

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W25N04KVTCIR TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 4GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25N04KVTCIR TR

  • Description:IC FLASH 4GBIT SPI/QUAD 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND
  • Memory Size:4Gbit
  • Memory Organization:512M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:250µs
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (8x6)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W25N04KVTCIR TR

W25N04KVTCIR TR

Memory IC Overview

The W25N04KVTCIR TR is a 4G-bit Single-Level Cell (SLC) QspiNAND flash memory manufactured by Winbond Electronics. It operates on a single 2.7V to 3.6V power supply and supports standard, dual, and quad SPI interfaces with clock frequencies up to 104MHz. The device features a 24-ball TFBGA package (8x6mm) and includes an internal 8-bit ECC engine for data integrity. It offers flexible architecture with 128KB block erase capabilities, hardware write protection, and low power consumption modes.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI interfaces with high-speed sequential read modes
  • Integrated 8-bit Error Correction Code (ECC) engine for enhanced data reliability
  • Hardware and software write protection mechanisms including OTP lockable registers
  • Space-efficient 24-ball TFBGA packaging suitable for compact system designs

Memory IC Applications

  • Code shadowing to RAM in embedded systems
  • Execute-in-place (XIP) applications via Dual/Quad SPI
  • Storage of voice, text, and general data files
  • Industrial control systems requiring wide temperature operation

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates tape and reel packaging configuration against official ordering guides. Confirm the 'TC' package code corresponds to the required 6x4 ball array variant. Ensure compatibility with host controller voltage levels within the 2.7V to 3.6V range. Check for RoHS compliance status and moisture sensitivity level requirements prior to assembly.

Memory IC Selection Notes

Select this component when high-density storage is needed in a small footprint. The TFBGA package is ideal for space-constrained PCB layouts. Consider the internal ECC feature if external error correction logic is unavailable. Verify that the host system supports the required SPI modes and clock speeds for optimal performance.

Memory IC Part Context

This part belongs to the W25N QspiNAND family, which combines SPI interface simplicity with NAND density. It is designed for applications requiring non-volatile storage with fast access times. The series supports various package options including WSON and TFBGA to accommodate different design constraints.

Memory IC Replacement Considerations

W25N04KVTCIR TR

Memory IC FAQ

What is the function of the /HOLD pin during Quad SPI operations?

During Quad SPI Read or Buffer Load commands, the /HOLD pin functions as a data I/O pin (IO3). The hold function is unavailable until the current Quad operation completes.

How does the Write Protect (/WP) pin operate in Hardware Protection mode?

When WP-E is set to 1, the /WP pin becomes a dedicated active-low input. If tied to GND, all write, program, and erase functions are disabled, making the entire device read-only.

W25N04KVTCIR TRW25N04KVTCIR TR

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