W25N04KVTCIU TR

Description：IC FLASH 4GBIT SPI/QUAD 24TFBGA
Series：SpiFlash®
Mfr：Winbond Electronics
Package：Tape & Reel (TR)

SKU:35c385647ccc Category: Memory IC Brand: Winbond Electronics

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Product introduction

W25N04KVTCIU TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 4GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25N04KVTCIU TR

Description：IC FLASH 4GBIT SPI/QUAD 24TFBGA
Series：SpiFlash®
Mfr：Winbond Electronics
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND
Memory Size：4Gbit
Memory Organization：512M x 8
Memory Interface：SPI - Quad I/O
Clock Frequency：104 MHz
Write Cycle Time - Word, Page：250µs
Voltage - Supply：2.7V ~ 3.6V
Operating Temperature：-40°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：24-TBGA
Supplier Device Package：24-TFBGA (8x6)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for W25N04KVTCIU TR

W25N04KVTCIU TR

Memory IC Overview

The W25N04KVTCIU TR is a 4G-bit SLC QspiNAND flash memory from Winbond Electronics, organized as 512M x 8. It operates on a single 2.7V to 3.6V supply and supports standard, dual, and quad SPI interfaces with clock frequencies up to 104MHz. The device features a 24-ball TFBGA 8x6-mm package (package code TC) and includes an internal 8-bit ECC engine. Key specifications include a page program time of 250µs, block erase time of 700µs, and a sequential read data transfer rate of 50MB/s.

Memory IC Feature Summary

Supports standard, dual, and quad SPI interfaces for flexible system integration
Includes an on-chip 8-bit ECC engine for improved memory reliability
Offers hardware and software write protection mechanisms via dedicated pins and registers
Provides buffer read and sequential read modes for efficient data access

Memory IC Applications

Code shadowing to RAM
Execute-in-place (XIP) applications
Voice, text, and data storage systems

Memory IC Procurement Notes

Verify the specific package code TC corresponds to the required 24-ball TFBGA configuration. Confirm that the trailing 'TR' indicates tape and reel packaging suitable for automated assembly processes. Ensure the voltage range of 2.7V to 3.6V aligns with the target system power supply design.

Memory IC Selection Notes

Select this component when a high-density 4G-bit NAND solution is required in a compact footprint. The TFBGA package offers space efficiency compared to traditional NAND options. Consider the internal ECC feature if error correction is needed without external processing overhead. Verify compatibility with existing SPI controller peripherals supporting dual and quad I/O modes.

Memory IC Part Context

This part belongs to the W25N QspiNAND family, which combines SPI interface simplicity with large NAND capacity. The W25N04KV variant specifically targets applications needing 4G-bit density. It shares architectural similarities with other members like the W25N01GV and W25N02KV but differs in capacity and package options.