Memory IC W25Q256JVCIM product image

W25Q256JVCIM

$2.17
  • Description:IC FLASH 256MBIT SPI 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:457fc5d72863 Category: Brand:

  
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W25Q256JVCIM is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 256MBIT SPI 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25Q256JVCIM

  • Description:IC FLASH 256MBIT SPI 24TFBGA
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:3ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W25Q256JVCIM

W25Q256JVCIM

Memory IC Overview

The W25Q256JVCIM is a 256M-bit (32M-byte) Serial Flash memory device from Winbond's SpiFlash family. It operates on a single 2.7V to 3.6V power supply and supports Standard, Dual, and Quad SPI interfaces with clock frequencies up to 133MHz. The memory array consists of 131,072 programmable pages of 256 bytes each, organized into uniform 4KB sectors and 64KB blocks. It features hardware write protection, security registers, and a unique 64-bit ID. The component is housed in a 24-ball TFBGA package measuring 8x6 mm.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI operations for flexible data transfer rates
  • Provides advanced security features including individual block/sector lock and OTP protection
  • Features hardware reset capability via dedicated /RESET pin on TFBGA packages
  • Enables Execute In Place (XIP) operation through Quad Peripheral Interface

Memory IC Applications

  • Code shadowing to RAM
  • Direct code execution from SPI bus (XIP)
  • Storage of voice, text, and data in space-constrained systems

Memory IC Procurement Notes

Verify the specific suffix 'C' corresponds to the 24-ball TFBGA 8x6-mm package configuration as documented in the datasheet. Confirm that the required hardware reset functionality is supported by this package variant. Ensure compatibility with the specified voltage range and interface requirements before integration.

Memory IC Selection Notes

Select this component when high-density storage is required in a compact form factor. The TFBGA package offers additional hardware reset capabilities not available in smaller packages. Consider the 133MHz clock speed and Quad SPI support for applications demanding high throughput or efficient XIP performance.

Memory IC Part Context

This part belongs to the W25Q256JV series, which includes variants in WSON-8, SOIC-16, and TFBGA packages. The 'C' suffix specifically denotes the 24-ball TFBGA package type. Other series members share identical electrical characteristics but differ in physical footprint and pin availability.

Memory IC Replacement Considerations

W25Q256JVBIQ TR

Memory IC FAQ

Does the W25Q256JVCIM package include a hardware reset pin?

Yes, the 24-ball TFBGA package includes a dedicated /RESET pin that can terminate operations and return the device to its power-on state.

What address modes are supported by this device?

The device supports both 3-Byte and 4-Byte Address Modes. The default mode upon power-up depends on the ADP bit setting in the status register.

W25Q256JVCIMW25Q256JVCIM
$2.17
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