Memory IC W25Q64CVWSP1 product image

W25Q64CVWSP1

  • Description:IC FLASH 64MBIT SPI/QUAD 80MHZ
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tube

SKU:f09898cdfaa5 Category: Brand:

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W25Q64CVWSP1 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 64MBIT SPI/QUAD 80MHZ. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W25Q64CVWSP1

  • Description:IC FLASH 64MBIT SPI/QUAD 80MHZ
  • Series:SpiFlash®
  • Mfr:Winbond Electronics
  • Package:Tube
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:80 MHz
  • Write Cycle Time - Word, Page:50µs, 3ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Access Time:6 ns

Memory IC datasheet and documents for W25Q64CVWSP1

W25Q64CVWSP1

Memory IC Overview

The W25Q64CVWSP1 is a 64 Mbit (8 M x 8) Serial NOR Flash memory component manufactured by Winbond Electronics. It operates on a single 2.7 V to 3.6 V power supply and supports Standard, Dual, and Quad SPI interfaces with clock frequencies up to 80 MHz. The device utilizes an 8-WSON package measuring 8 mm by 6 mm. Key electrical parameters include a typical active current of 4 mA and a power-down current of less than 1 µA. It features uniform sector/block erase structures of 4 KB, 32 KB, and 64 KB, with page programming capabilities for up to 256 bytes. The operational temperature range spans from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-performance continuous read modes via Dual and Quad SPI interfaces for efficient code execution.
  • Provides flexible architecture with uniform 4 KB sectors and 32 KB or 64 KB blocks for erasure operations.
  • Integrates advanced security features including hardware and software write protection mechanisms.

Memory IC Applications

  • Code shadowing to RAM in embedded systems
  • Direct code execution (XIP) via Dual/Quad SPI
  • Storage of voice, text, and data in space-constrained devices

Memory IC Procurement Notes

Verify the specific suffix 'WSP1' against official Winbond documentation to confirm exact package dimensions and tape-and-reel specifications. Ensure compatibility with existing PCB footprints for the 8-WSON form factor. Confirm voltage requirements align with the 2.7 V to 3.6 V operating range before integration into the target system design.

Memory IC Selection Notes

Select this component when a compact 8-pin surface-mount solution is required for 64 Mbit storage. It is suitable for applications demanding low power consumption and moderate speed via Quad SPI. Consider alternative packages if higher thermal dissipation or different pin counts are necessary for the specific board layout constraints.

Memory IC Part Context

This part belongs to the W25Q64CV series of SpiFlash memories designed for systems with limited space, pins, and power. It offers performance exceeding ordinary serial flash devices through dual and quad I/O capabilities. The series is engineered for reliability with over 100,000 erase/program cycles and more than 20-year data retention under specified conditions.

Memory IC Replacement Considerations

Compatible substitutes within the same family include W25Q64CVSSIQ and W25Q64CVZEJP. Verify that replacement parts match the required 80 MHz clock speed and 8-WSON package dimensions to ensure physical and electrical compatibility without redesigning the host circuit.

W25Q64CVWSP1W25Q64CVWSP1

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