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W25Q64JVTBIQ is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 64MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
The W25Q64JVTBIQ is a 64 Mbit (8 M x 8) Serial NOR Flash memory from Winbond's W25Q64JV series. It supports Standard, Dual, and Quad SPI interfaces with clock frequencies up to 133 MHz. The device operates on a single 2.7 V to 3.6 V supply and features an industrial temperature range of -40°C to +85°C. It utilizes a 24-ball TFBGA package measuring 8x6 mm with a 5x5 ball array configuration.
Verify the specific ordering suffix against official documentation to confirm package type and temperature grade. Ensure compatibility with existing PCB footprints for the 24-ball TFBGA configuration. Confirm that the required voltage levels align with the 2.7 V to 3.6 V operating range specified for this component.
Select this component when a compact footprint is necessary alongside high-performance read speeds. The TFBGA package offers significant space savings compared to standard SOIC options. Consider the industrial temperature rating if the application environment exceeds standard commercial limits.
This part belongs to the W25Q64JV family, designed for applications demanding high density and performance within limited physical spaces. The series integrates advanced security features and flexible erase structures to support complex firmware architectures and parameter storage requirements.
W25Q64JVCBIQ
Yes, the TFBGA package variant includes a dedicated hardware /RESET pin that can interrupt operations and return the device to its power-on state.
The device supports SPI clock frequencies up to 133 MHz, enabling equivalent transfer rates of 266 MHz for Dual I/O and 532 MHz for Quad I/O.
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