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W29N01HVDINF TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 1GBIT 48-VFBGA. Review the specifications below when checking this part for your BOM.
The W29N01HVDINF TR is a 1G-bit SLC NAND flash memory from Winbond, organized as 128M x 8 bits. It operates on a single 2.7V to 3.6V power supply with active current consumption of 25mA and standby current of 10uA. The device features a multiplexed 8-bit bus for data, address, and command transfer. Key performance metrics include a random read time of 25μs, sequential read cycle of 25ns, page program time of 250μs, and block erase time of 2ms. It supports an endurance of 100,000 erase/program cycles and 10-year data retention.
Verify the specific package code 'D' corresponds to the required 48-ball VFBGA form factor. Confirm that the 'TR' suffix indicates tape and reel packaging suitable for automated surface-mount assembly. Ensure the operating voltage range of 2.7V to 3.6V aligns with the target system's power rails. Check for RoHS compliance status if environmental regulations apply to the final product deployment.
Select this component when a single-chip 1G-bit solution is needed for space-constrained designs. The 8-bit bus width simplifies PCB routing compared to wider interfaces. Consider the industrial temperature range (-40°C to 85°C) for robustness. Evaluate the 25ns sequential read cycle against system timing requirements. Ensure the controller supports the standard NAND command set and copy-back operations for optimal performance.
This part belongs to the W29N01HV series, which provides 1G-bit density solutions. It is designed as a drop-in replacement or upgrade for older 128M-bit parts where higher capacity is required without changing the footprint significantly. The series emphasizes low power consumption and high performance for mobile and industrial embedded applications.
Check datasheet Section 15 for valid part numbers within the same family. Verify compatibility with existing board layouts if switching between TSOP and VFBGA packages. Ensure software drivers support the specific parameter page structure if ONFI compatibility is required.
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