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W29N02GVBIAF TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 2GBIT 63-VFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for W29N02GVBIAF TR
- Description：IC FLASH 2GBIT 63-VFBGA
- Series：-
- Mfr：Winbond Electronics
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：2Gbit
- Memory Organization：256M x 8
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：25ns
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：63-VFBGA
- Supplier Device Package：63-VFBGA (9x11)
- Access Time：25 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for W29N02GVBIAF TR
Memory IC Overview
The W29N02GVBIAF TR is a 2 Gbit Single-Level Cell (SLC) NAND flash memory device manufactured by Winbond Electronics. It features a parallel interface with an organization of 256 M x 8 bits and an 8-bit data bus width. The component operates within a voltage range of 1.7 V to 3.6 V, supporting both 1.8 V and 3.0 V logic levels. It utilizes a 63-pin VFBGA package measuring 9x11 mm with a height of 0.6 mm. The device supports a random access time of 25 ns and functions reliably across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Single-level cell architecture for high endurance and reliability
- Parallel interface supporting standard NAND command sets
- Dual voltage operation compatible with 1.8V and 3.0V systems
- Industrial temperature rating for robust environmental performance
Memory IC Applications
- Embedded storage in consumer electronics
- Industrial control system firmware storage
- Network infrastructure equipment
- Automotive infotainment systems
Memory IC Procurement Notes
Verify the specific suffix configuration against official Winbond documentation to ensure correct voltage and package specifications. Confirm moisture sensitivity level handling requirements during assembly. Cross-reference the exact part number with manufacturer datasheets to validate pinout and electrical characteristics before integration into design schematics.
Memory IC Selection Notes
Select this component for applications requiring reliable SLC NAND performance with parallel interface compatibility. Ensure the host system supports the required 1.8V or 3.0V power rails. Verify that the PCB layout accommodates the 63-pin VFBGA footprint dimensions. Consider the operating temperature range suitability for the intended deployment environment.
Memory IC Part Context
This part belongs to the Winbond W29N02GZ series of SLC NAND flash memories. The series is designed for general-purpose non-volatile storage needs. It offers a balance of density and speed suitable for code execution and data storage. The VFBGA package provides a compact solution for space-constrained designs.
Memory IC Replacement Considerations
Direct substitutes include other 2Gbit SLC NAND parts with parallel interfaces and similar voltage ranges. Verify pin compatibility and command set adherence when considering alternatives from different manufacturers.
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