Memory IC W29N04KZBIBG TR product image

W29N04KZBIBG TR

$5.26
  • Description:IC FLASH 4GBIT ONFI 63VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:f2b10cfc7046 Category: Brand:

  
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W29N04KZBIBG TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC FLASH 4GBIT ONFI 63VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W29N04KZBIBG TR

  • Description:IC FLASH 4GBIT ONFI 63VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:4Gbit
  • Memory Organization:512M x 8
  • Memory Interface:ONFI
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:35ns, 700µs
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-VFBGA
  • Supplier Device Package:63-VFBGA (9x11)
  • Access Time:25 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W29N04KZBIBG TR

W29N04KZBIBG TR

Memory IC Overview

The W29N04KZBIBG TR is a 4G-bit Single-Level Cell NAND flash memory manufactured by Winbond Electronics. It operates on a single 1.7V to 1.95V power supply and features an x8 data bus width. The device is housed in a 63-ball VFBGA package with a 9x11mm footprint. It supports standard NAND interfaces and includes hardware write protection via the #WP pin. The memory array consists of 2,048 blocks, each containing 64 pages of 4,352 bytes. It offers high endurance of 60,000 erase/program cycles and a 10-year data retention capability.

Memory IC Feature Summary

  • Utilizes Single-Level Cell (SLC) technology for reliable data storage.
  • Supports standard NAND command sets including Copy Back operations.
  • Includes hardware write protect functionality to prevent inadvertent programming.
  • Features low power consumption with dedicated standby modes.

Memory IC Applications

  • Code shadowing to RAM
  • Solid state storage applications
  • Embedded systems with limited space and pins

Memory IC Procurement Notes

Verify the specific suffix 'TR' indicates reel packaging when sourcing. Confirm the 'B' package code corresponds to the 63-ball VFBGA form factor required for your PCB layout. Ensure the voltage range matches your system's 1.8V rail specifications. Check for moisture sensitivity level requirements during assembly processing.

Memory IC Selection Notes

Select this component for designs requiring high density in a compact surface-mount package. The x8 interface suits systems with narrower data buses. Consider the industrial temperature range if operating in extreme environments. Verify that the host controller supports the specific command set and timing parameters defined in the datasheet.

Memory IC Part Context

This part belongs to the W29N04KW/ZxxBG family from Winbond. It is designed as a cost-effective solution for embedded storage needs. The family shares core electrical characteristics but varies in package type and temperature rating. The W29N04KZBIBG specifically denotes the industrial grade version in the VFBGA package.

Memory IC Replacement Considerations

Direct replacements must match the 4G-bit density, 1.8V operation, and 63-ball VFBGA package. Verify compatibility with existing firmware drivers due to potential differences in parameter page structures or timing constraints between manufacturers.

Memory IC FAQ

What is the function of the #WP pin?

The #WP pin provides hardware write protection. When active low, it disables all program and erase operations to prevent accidental data modification.

How is the memory organized?

The memory is organized into 2,048 erasable blocks. Each block contains 64 programmable pages, with each page sized at 4,352 bytes (4,096 bytes main data plus 256 bytes spare area).

W29N04KZBIBG TRW29N04KZBIBG TR
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