W631GG6KB-11

Memory IC Overview

The W631GG6KB-11 is a 1 Gbit DDR3 SDRAM organized as 8,388,608 words by 16 bits with eight internal banks. It supports a maximum operating frequency of 933 MHz compliant with the DDR3-1866 specification (13-13-13). The device operates within a voltage range of 1.425 V to 1.575 V and functions at commercial temperatures from 0°C to 95°C. It utilizes a 96-ball WBGA package measuring 9x13 mm.

Memory IC Feature Summary

• Supports high-speed data transfer rates up to 1,866 Mb/sec/pin using double data rate architecture.
• Features programmable on-die termination for improved signal integrity during writes.
• Includes ZQ calibration capability for output driver and ODT adjustment using an external reference resistor.
• Provides system-level timing calibration support via write leveling and Multi Purpose Register read patterns.

Memory IC Applications

• High-performance computing systems requiring fast memory access
• Industrial control applications operating in extended temperature ranges
• Embedded systems utilizing surface-mount technology

Memory IC Procurement Notes

Verify the specific speed grade suffix against the required operational frequency and temperature range before ordering. Confirm that the procurement channel provides official documentation matching the datasheet revision A10. Ensure compatibility with the 96-ball WBGA footprint during component sourcing.

Memory IC Selection Notes

Select this part when a 16-bit wide interface is required for 1 Gbit capacity. The -11 suffix indicates compliance with the fastest DDR3-1866 speed bin. Consider alternative suffixes if industrial temperature ratings or different speed grades are necessary for the target application environment.

Memory IC Part Context

This component belongs to the Winbond W631GG6KB family of DDR3 SDRAM devices. The family shares common architectural features including SSTL_15 interface standards and differential clock inputs. Variations within the series differ primarily in speed bins and specified operating temperature ranges.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: None identified in source material.