Memory IC W631GG6KB12I TR product image

W631GG6KB12I TR

  • Description:IC DRAM 1GBIT PARALLEL 96WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:704cd11b6fac Category: Brand:

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W631GG6KB12I TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 1GBIT PARALLEL 96WBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W631GG6KB12I TR

  • Description:IC DRAM 1GBIT PARALLEL 96WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:1Gbit
  • Memory Organization:64M x 16
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-TFBGA
  • Supplier Device Package:96-WBGA (9x13)
  • Access Time:20 ns

Memory IC datasheet and documents for W631GG6KB12I TR

W631GG6KB12I TR

Memory IC Overview

The Winbond W631GG6KB12I TR is a 1 Gbit DDR3 SDRAM organized as 64 Meg words by 16 bits. It operates at a maximum clock frequency of 800 MHz, corresponding to the DDR3-1600 speed grade. The device utilizes a 96-ball WBGA package with dimensions of 9x13 mm. It supports a supply voltage range of 1.425 V to 1.575 V and features an access time of 20 ns. The component is designed for industrial temperature applications, functioning reliably between -40°C and +95°C.

Memory IC Feature Summary

  • Supports high-speed data transfer rates up to 1600 Mb/sec/pin via double data rate architecture.
  • Features eight internal banks allowing for concurrent operations and improved system efficiency.
  • Includes programmable on-die termination (ODT) and dynamic ODT modes to enhance signal integrity.
  • Provides write leveling and Multi Purpose Register (MPR) capabilities for system timing calibration.

Memory IC Applications

  • Industrial control systems requiring reliable memory under extreme temperatures
  • Automotive electronics operating within specified thermal ranges
  • High-performance computing platforms utilizing DDR3 interfaces
  • Communication infrastructure equipment

Memory IC Procurement Notes

Verify the specific ordering suffix 'TR' to confirm reel packaging requirements against your assembly line specifications. Ensure that the industrial temperature rating (-40°C to +95°C) aligns with your environmental design constraints. Cross-reference the 96-ball WBGA footprint with your PCB layout guidelines to guarantee mechanical compatibility during procurement.

Memory IC Selection Notes

Select this component when a 16-bit wide interface is required for DDR3-1600 performance levels. Consider the 96-ball WBGA package size relative to available board space. Evaluate the power consumption characteristics against your system's thermal management capabilities. Confirm that the controller supports the necessary mode register settings for CAS latency and burst length configurations.

Memory IC Part Context

This part belongs to the W631GG6KB series of DDR3 SDRAMs manufactured by Winbond Electronics. The series offers various speed grades and temperature ratings to suit different application needs. The '12I' designation specifically indicates the DDR3-1600 speed bin combined with the extended industrial temperature range capability.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not provided in the source material. Verify pin-to-pin compatibility and electrical parameter alignment before considering alternative manufacturers or speed grades within the same family.

W631GG6KB12I TRW631GG6KB12I TR

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