W631GU6NB15J

Description：IC DRAM 1GBIT PAR 96VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray

SKU:1159d0bbbf4a Category: Memory IC Brand: Winbond Electronics

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Product introduction

W631GU6NB15J is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 1GBIT PAR 96VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W631GU6NB15J

Description：IC DRAM 1GBIT PAR 96VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR3L
Memory Size：1Gbit
Memory Organization：64M x 16
Memory Interface：Parallel
Clock Frequency：667 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.283V ~ 1.45V, 1.425V ~ 1.575V
Operating Temperature：-40°C ~ 105°C (TC)
Mounting Type：Surface Mount
Package / Case：96-VFBGA
Supplier Device Package：96-VFBGA (7.5x13)
Access Time：20 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for W631GU6NB15J

W631GU6NB15J

Memory IC Overview

The W631GU6NB15J is a 1 Gbit DDR3L SDRAM organized as 8,388,608 words by 8 banks by 16 bits. It supports speeds up to DDR3L-1333 with a maximum operating frequency of 667 MHz and timing parameters of 9-9-9. The device operates at a typical voltage of 1.35V (range 1.283V to 1.45V) and is backward compatible with 1.5V. It features an 8-bit prefetch architecture, differential clock inputs, and programmable CAS latency. Packaged in a VFBGA-96 (7.5 x 13 mm), it supports industrial plus temperature ranges from -40°C to 105°C.

Memory IC Feature Summary

Supports double data rate architecture with two data transfers per clock cycle for high-speed performance.
Features eight internal banks allowing concurrent operations to improve system efficiency.
Includes on-die termination (ODT) and ZQ calibration to enhance signal integrity.
Provides asynchronous reset functionality for reliable power-up initialization sequences.

Memory IC Applications

Industrial control systems requiring extended temperature stability
Automotive electronics demanding robust memory solutions
Embedded systems utilizing DDR3L interfaces

Memory IC Procurement Notes

Verify the specific speed grade suffix 'J' corresponds to the required 105°C maximum case temperature rating. Confirm that the 1.35V DDR3L supply requirements align with the target platform's voltage rails. Ensure PCB layout accommodates the VFBGA-96 package dimensions and pitch specifications for proper soldering.

Memory IC Selection Notes

Select this component when a 16-bit wide interface is necessary for bandwidth optimization. The 'J' suffix indicates suitability for environments exceeding standard industrial limits. Consider the 1.35V operation for reduced power consumption compared to legacy 1.5V parts. Verify compatibility with host controllers supporting DDR3L protocols and ODT configurations.

Memory IC Part Context

This part belongs to the W631GU6NB family of low-voltage synchronous dynamic random access memories. It represents a density tier within Winbond's DDR3L portfolio designed for compact form factors. The series emphasizes energy efficiency and signal reliability through advanced calibration features.