Memory IC W631GU8KB12I product image

W631GU8KB12I

  • Description:IC DRAM 1GBIT PARALLEL 78WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:ed5a032cc0d2 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

W631GU8KB12I is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 1GBIT PARALLEL 78WBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W631GU8KB12I

  • Description:IC DRAM 1GBIT PARALLEL 78WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-WBGA (10.5x8)
  • Access Time:20 ns

Memory IC datasheet and documents for W631GU8KB12I

W631GU8KB12I

Memory IC Overview

The W631GU8KB12I is a 1Gbit DDR3L SDRAM organized as 16M words x 8 banks x 8 bits. It supports a maximum operating frequency of 800 MHz, compliant with the DDR3L-1600 specification (11-11-11). The device operates at a typical voltage of 1.35V, with a range of 1.283V to 1.45V, and is backward compatible with 1.5V. It features an industrial temperature rating of -40°C to 95°C and is packaged in a 78-ball WBGA.

Memory IC Feature Summary

  • Supports double data rate architecture with two data transfers per clock cycle for high-speed performance.
  • Includes eight internal banks allowing concurrent operations to improve efficiency.
  • Features programmable on-die termination (ODT) and dynamic ODT modes to enhance signal integrity.
  • Provides system-level timing calibration support via write leveling and Multi Purpose Register (MPR).

Memory IC Applications

  • Industrial control systems requiring extended temperature stability
  • Automotive electronics applications
  • Embedded systems with memory constraints

Memory IC Procurement Notes

Verify the specific speed grade suffix '12I' corresponds to the required DDR3L-1600 performance and industrial temperature range during procurement. Confirm package compatibility with the 78-ball WBGA footprint. Ensure supply chain sources are authorized to avoid counterfeit components, as this part may have limited availability or end-of-life status.

Memory IC Selection Notes

Select the W631GU8KB12I when a 1Gbit capacity with an 8-bit data bus width is required for DDR3L-1600 speeds. This component is suitable for designs needing low power consumption at 1.35V while maintaining backward compatibility with 1.5V systems. Consider the industrial temperature range if the application environment exceeds standard commercial limits.

Memory IC Part Context

This component belongs to the Winbond W631GU8KB series of DDR3L SDRAMs. The series offers various speed grades (-11, -12, -15) and temperature ranges. The '12I' designation specifically identifies the industrial-grade variant optimized for 800 MHz operation, distinguishing it from commercial versions and higher-speed bins within the same family.

Memory IC Replacement Considerations

Compatible substitutes include other W631GU8KB variants with matching speed grades and packages, such as W631GU8KB-12 for commercial use or W631GU8KB15I for lower frequency requirements. Verify pinout and electrical specifications before substitution.

W631GU8KB12IW631GU8KB12I

Click on the inquiry