Memory IC W631GU8MB11I TR product image

W631GU8MB11I TR

  • Description:IC DRAM 1GBIT PAR 78VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:7344b01d7182 Category: Brand:

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W631GU8MB11I TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 1GBIT PAR 78VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W631GU8MB11I TR

  • Description:IC DRAM 1GBIT PAR 78VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-VFBGA
  • Supplier Device Package:78-VFBGA (10.5x8)
  • Access Time:20 ns

Memory IC datasheet and documents for W631GU8MB11I TR

W631GU8MB11I TR

Memory IC Overview

The W631GU8MB11I TR is a 1G-bit DDR3L SDRAM organized as 16M words x 8 banks x 8 bits. It supports speeds up to 1866 MT/s (DDR3L-1866) with CL-13-13-13 timing. Operating voltage ranges from 1.283V to 1.45V, compatible with 1.5V. The device features an asynchronous reset, ZQ calibration, and programmable on-die termination. It operates within -40°C to +95°C and is packaged in a 78-ball VFBGA.

Memory IC Feature Summary

  • Supports double data rate architecture with eight internal banks for concurrent operations.
  • Includes dynamic ODT mode and ZQ calibration for improved signal integrity.
  • Features write leveling and Multi Purpose Register (MPR) for system timing calibration.
  • Provides asynchronous reset functionality for power-up initialization sequences.

Memory IC Applications

  • Industrial control systems requiring extended temperature stability
  • Automotive electronics applications
  • Embedded memory solutions

Memory IC Procurement Notes

Verify the specific speed grade suffix '11I' corresponds to the required 1866 MT/s performance and industrial temperature range (-40°C to +95°C). Confirm that the trailing 'TR' indicates tape-and-reel packaging rather than tray format. Ensure compatibility with the host controller's DDR3L signaling requirements before procurement.

Memory IC Selection Notes

Select this component when a 1Gb density with 8-bit width is required for high-speed data processing. The industrial temperature rating makes it suitable for harsh environments. Consider the 78-ball VFBGA package dimensions for PCB layout constraints. Verify that the supporting circuitry can handle the differential clock inputs and source-synchronous data strobes.

Memory IC Part Context

This part belongs to the W631GU8MB family of low-voltage DDR3L SDRAMs. It shares architectural similarities with other variants like the W631GU8NB series but differs in speed grades and operating temperatures. The '11I' designation specifically identifies the 1866 MT/s industrial grade within the broader Winbond DRAM portfolio.

Memory IC Replacement Considerations

W631GU8MB-11

Memory IC FAQ

What is the maximum operating frequency for the W631GU8MB11I?

The maximum operating frequency is 933 MHz, corresponding to the DDR3L-1866 speed grade.

Does the W631GU8MB11I support backward compatibility with standard DDR3?

Yes, the device is backward compatible with 1.5V DDR3 SDRAM VDD/VDDQ requirements.

W631GU8MB11I TRW631GU8MB11I TR

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