Memory IC W632GG6KB12I TR product image

W632GG6KB12I TR

  • Description:IC DRAM 2GBIT 96-WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:19aecb9b53f3 Category: Brand:

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W632GG6KB12I TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT 96-WBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GG6KB12I TR

  • Description:IC DRAM 2GBIT 96-WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:-
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-TFBGA
  • Supplier Device Package:96-WBGA (9x13)
  • Access Time:20 ns

Memory IC datasheet and documents for W632GG6KB12I TR

W632GG6KB12I TR

Memory IC Overview

The W632GG6KB12I TR is a 2 Gbit DDR3 SDRAM organized as 16M x 16 with eight internal banks. It supports a maximum operating frequency of 800 MHz (DDR3-1600) and operates within an industrial temperature range of -40°C to +95°C. The device utilizes a 96-ball WBGA package and requires a 1.5V power supply. Key electrical parameters include a CAS latency range of 6 to 11, supported write recovery times, and specific timing constraints for read and write operations compliant with the DDR3-1600 specification.

Memory IC Feature Summary

  • Supports high-speed data transfer rates up to 1,866 Mb/sec/pin across various speed grades.
  • Features eight internal banks enabling concurrent operation and improved system efficiency.
  • Includes programmable on-die termination (ODT) for data, data mask, and differential strobe pairs.
  • Provides system-level timing calibration support via write leveling and Multi Purpose Register (MPR) read patterns.

Memory IC Applications

  • Industrial embedded systems requiring extended temperature stability
  • High-performance computing memory subsystems
  • Network infrastructure equipment

Memory IC Procurement Notes

Verify the exact suffix 'TR' against the manufacturer's official documentation to confirm tape-and-reel packaging specifications. Confirm that the '12I' designation strictly aligns with the required industrial temperature range (-40°C to +95°C). Ensure compatibility with the host controller's voltage levels and signal integrity requirements before finalizing procurement.

Memory IC Selection Notes

Select this component when an 800 MHz DDR3 interface is required alongside industrial-grade thermal resilience. Compare the 16-bit width against system bus architecture needs. Evaluate the 96-ball WBGA footprint against available PCB real estate. Consider the availability of supporting mode registers for customizing burst lengths and latency settings.

Memory IC Part Context

This part belongs to the Winbond W632GG6KB series of DDR3 SDRAMs. The series offers multiple speed grades including -11, -12, and -15 variants. The '12I' suffix specifically denotes the industrial temperature grade compliant with the DDR3-1600 standard. The series is designed for applications demanding high bandwidth and low power consumption.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not provided in the source material. Verify pinout and electrical compatibility if considering alternative manufacturers or different speed grades within the same family.

Memory IC FAQ

What is the maximum operating frequency for the W632GG6KB12I?

The maximum operating frequency is 800 MHz, corresponding to the DDR3-1600 speed grade.

Does this device support dynamic ODT?

Yes, the device supports Dynamic ODT mode for improved signal integrity and preselectable termination impedances during writes.

W632GG6KB12I TRW632GG6KB12I TR

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