W632GG6MB-18

Memory IC Overview

The W632GG6MB is a 2Gbit DDR3 SDRAM organized as 16M x 8 banks x 16 bits. It supports transfer rates up to 2133 MT/s (DDR3-2133). Speed grades include -09, -11, -12, and -15 for commercial temperatures (0°C to 95°C), with industrial variants (-09I/11I/12I/15I) supporting -40°C to 95°C, and enhanced industrial variants (-09J/11J/12J/15J) supporting -40°C to 105°C. The device operates at VDD/VDDQ = 1.5V ± 0.075V and is packaged in a 96-ball VFBGA.

Memory IC Feature Summary

• Supports double data rate architecture with eight internal banks for concurrent operation
• Features programmable on-die termination (ODT) and dynamic ODT mode for signal integrity
• Includes Multi Purpose Register (MPR) for system timing calibration via write leveling
• Provides asynchronous reset functionality and ZQ calibration capabilities

Memory IC Applications

• High-speed parallel memory systems requiring DDR3 interface
• Embedded applications needing extended temperature range support
• Systems utilizing write leveling and MPR for timing calibration

Memory IC Procurement Notes

Verify the specific speed grade suffix (e.g., -09, -11, -12, -15) and operating temperature extension (I or J suffix) against the design requirements. Confirm that the voltage supply matches the standard 1.5V specification. Ensure the package type corresponds to the 96-ball VFBGA footprint. Check for any recent Product Change Notifications regarding manufacturing updates.

Memory IC Selection Notes

Select based on required clock frequency and CAS latency settings. Commercial grades cover 0°C to 95°C, while I and J suffixes extend to -40°C. Higher speed grades like -09 support up to 2133 MT/s, whereas -15 supports up to 1333 MT/s. Consider the need for Partial Array Self Refresh (PASR) or Auto Self Refresh (ASR) features for power management.

Memory IC Part Context

This component belongs to the Winbond W632GG6MB series of DDR3 SDRAM devices. It is part of a broader family offering various speed grades and temperature ranges. The device utilizes an SSTL_15 interface and is designed for high-performance memory applications where low power consumption and high bandwidth are critical.

Memory IC Replacement Considerations

Direct substitutes within the same series include other speed grades such as W632GG6MB-11, W632GG6MB-12, or W632GG6MB-15, provided the system timing constraints allow for lower frequencies. Industrial variants like W632GG6MB09I or W632GG6MB09J offer wider temperature ranges.