Memory IC W632GU8KB-15 product image

W632GU8KB-15

  • Description:IC DRAM 2GBIT PAR 78WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:31ae25dd2e4a Category: Brand:

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W632GU8KB-15 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 78WBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GU8KB-15

  • Description:IC DRAM 2GBIT PAR 78WBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:667 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-TFBGA
  • Supplier Device Package:78-WBGA (10.5x8)
  • Access Time:20 ns

Memory IC datasheet and documents for W632GU8KB-15

W632GU8KB-15

Memory IC Overview

The W632GU8KB-15 is a 2 Gbit DDR3L SDRAM organized as 33,554,432 words by 8 banks by 8 bits. It supports maximum operating frequencies up to 667 MHz compliant with the DDR3L-1333 specification (9-9-9 timing). The device operates at a typical voltage of 1.35V, with a range of 1.283V to 1.45V, and is backward compatible with 1.5V operation. It utilizes a WBGA 78-ball package.

Memory IC Feature Summary

  • Supports double data rate architecture with eight internal banks for concurrent operations.
  • Includes programmable on-die termination and dynamic ODT modes for signal integrity.
  • Features write leveling and Multi Purpose Register support for system timing calibration.
  • Provides asynchronous reset functionality for power-up initialization sequences.

Memory IC Applications

  • Consumer electronics requiring high-speed memory interfaces
  • Communication equipment utilizing DDR3L standards
  • Industrial applications requiring extended temperature ranges

Memory IC Procurement Notes

Verify the specific speed grade suffix against the required timing parameters before procurement. Confirm that the ordering suffix accurately reflects the intended operating temperature range and frequency bin. Ensure compatibility with the host system's voltage requirements and interface specifications.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity with an 8-bit data bus width is required. Choose the -15 suffix specifically for systems operating at or below 667 MHz. Consider the industrial variant if operation below 0°C is necessary. Verify package availability matches the PCB layout constraints.

Memory IC Part Context

This part belongs to the Winbond W632GU8KB series of low-power DDR3 SDRAM devices. The series offers various speed grades to accommodate different system performance requirements. The -15 designation indicates compliance with the DDR3L-1333 standard, providing a balance between performance and power efficiency for mainstream applications.

Memory IC Replacement Considerations

Direct substitutes include other parts within the W632GU8KB family with matching speed grades, such as the W632GU8KB-12 for higher frequency needs. Cross-family replacements require verification of pinout compatibility and electrical characteristics.

Memory IC FAQ

What is the maximum operating frequency for the W632GU8KB-15?

The W632GU8KB-15 supports a maximum operating frequency of 667 MHz, corresponding to the DDR3L-1333 specification.

Is the W632GU8KB-15 compatible with 1.5V systems?

Yes, the device is backward compatible with 1.5V VDD and VDDQ supplies, in addition to its primary 1.35V operation.

W632GU8KB-15W632GU8KB-15

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