W632GU8MB-11

Description：IC DRAM 2GBIT PAR 78VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray

SKU:e72f7b162f1d Category: Memory IC Brand: Winbond Electronics

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Product introduction

W632GU8MB-11 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 78VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GU8MB-11

Description：IC DRAM 2GBIT PAR 78VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR3
Memory Size：2Gbit
Memory Organization：128M x 16
Memory Interface：Parallel
Clock Frequency：933 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：1.283V ~ 1.45V
Operating Temperature：0°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：78-VFBGA
Supplier Device Package：78-VFBGA (8x10.5)
Access Time：20 ns

Memory IC datasheet and documents for W632GU8MB-11

W632GU8MB-11

Memory IC Overview

The W632GU8MB-11 is a 2 Gbit DDR3L SDRAM organized as 32M words x 8 banks x 8 bits. It supports a maximum operating frequency of 933 MHz and complies with the DDR3L-1866 specification (13-13-13). The device operates within a voltage range of 1.283V to 1.45V, with backward compatibility to 1.5V. It utilizes a VFBGA-78 package and supports an industrial temperature range of 0°C to 95°C.

Memory IC Feature Summary

Supports double data rate architecture with eight internal banks for concurrent operations.
Includes programmable CAS latency, write leveling, and dynamic on-die termination for signal integrity.
Features Multi Purpose Register (MPR) for system timing calibration bit sequence readout.
Provides Partial Array Self Refresh (PASR) and Auto Self Refresh (ASR) capabilities.

Memory IC Applications

High-speed embedded systems requiring low power consumption.
Industrial control terminals operating in extended temperature ranges.
Automotive electronics demanding reliable volatile memory storage.

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required clock frequency. Confirm the temperature range suffix aligns with environmental constraints. Check RoHS compliance status. Ensure the package type corresponds to the PCB footprint design. Validate supply chain availability through authorized distributors.

Memory IC Selection Notes

Select this component for applications needing 2Gb capacity with an 8-bit interface width. Choose based on the required operating frequency and thermal environment. Consider the VFBGA-78 package size for board layout constraints. Evaluate power requirements against the 1.35V typical supply voltage specifications.

Memory IC Part Context

This part belongs to the Winbond W632GU8MB series of DDR3L SDRAM devices. The series offers various speed grades and temperature options. It is designed for mobile and specialty DRAM markets. The device integrates standard DDR3L features with enhanced calibration tools.