Memory IC W632GU8NB-11 product image

W632GU8NB-11

  • Description:IC DRAM 2GBIT PAR 78VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:0cf0bba0f557 Category: Brand:

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W632GU8NB-11 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 78VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GU8NB-11

  • Description:IC DRAM 2GBIT PAR 78VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-VFBGA
  • Supplier Device Package:78-VFBGA (8x10.5)
  • Access Time:20 ns

Memory IC datasheet and documents for W632GU8NB-11

W632GU8NB-11

Memory IC Overview

The W632GU8NB-11 is a 2 Gbit DDR3L SDRAM organized as 32M x 8 banks x 8 bits. It supports speeds up to 933 MHz (DDR3L-1866) with timings of 13-13-13. Operating voltage ranges from 1.283 V to 1.45 V, backward compatible to 1.5 V. The device features an 8-bit prefetch architecture, differential clock inputs, and DLL alignment. Packaged in a 78-ball VFBGA, it operates within a commercial temperature range of 0°C to 95°C.

Memory IC Feature Summary

  • Supports double data rate architecture with two data transfers per clock cycle for high-speed transfer rates.
  • Features eight internal banks allowing concurrent operation and an 8-bit prefetch architecture.
  • Includes programmable on-die termination (ODT) and dynamic ODT mode for improved signal integrity.
  • Provides system-level timing calibration support via write leveling and Multi Purpose Register (MPR) read patterns.

Memory IC Applications

  • High-speed embedded systems requiring efficient memory bandwidth
  • Industrial control terminals operating in standard commercial environments
  • Consumer electronics utilizing DDR3L interface standards

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required frequency bin. Confirm that the package type corresponds to the design footprint. Check RoHS compliance status if environmental regulations apply. Ensure the operating temperature range aligns with the intended deployment environment. Validate pin compatibility with existing PCB layouts before finalizing orders.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity with an 8-bit data bus width is required. Choose the -11 suffix specifically for designs targeting 933 MHz maximum frequencies. Consider the VFBGA-78 package constraints during layout planning. Evaluate power consumption requirements against the specified IDD parameters for active and self-refresh modes.

Memory IC Part Context

This part belongs to the Winbond W632GU8NB series of DDR3L SDRAM devices. The series offers various speed grades and temperature ratings to suit different application needs. The -11 designation indicates compliance with the DDR3L-1866 specification. It represents a balance between performance and power efficiency for modern memory applications.

Memory IC Replacement Considerations

W632GU8NB11I

Memory IC FAQ

What is the maximum operating frequency for the W632GU8NB-11?

The maximum operating frequency is 933 MHz, compliant with the DDR3L-1866 specification.

Does the W632GU8NB-11 support 1.5V operation?

Yes, the device is backward compatible to VDD/VDDQ = 1.5V ± 0.075V.

W632GU8NB-11W632GU8NB-11

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