W632GU8NB11I

Description：IC DRAM 2GBIT PAR 78VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray

SKU:25a185e5f8f6 Category: Memory IC Brand: Winbond Electronics

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Product introduction

W632GU8NB11I is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT PAR 78VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W632GU8NB11I

Description：IC DRAM 2GBIT PAR 78VFBGA
Series：-
Mfr：Winbond Electronics
Package：Tray
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR3L
Memory Size：2Gbit
Memory Organization：256M x 8
Memory Interface：Parallel
Clock Frequency：933 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.283V ~ 1.45V
Operating Temperature：-40°C ~ 95°C (TC)
Mounting Type：Surface Mount
Package / Case：78-VFBGA
Supplier Device Package：78-VFBGA (8x10.5)
Access Time：20 ns

Memory IC datasheet and documents for W632GU8NB11I

W632GU8NB11I

Memory IC Overview

The W632GU8NB11I is a 2 Gbit DDR3L SDRAM organized as 32M x 8 with eight internal banks. It supports a maximum operating frequency of 933 MHz and complies with the DDR3L-1866 specification (13-13-13). The device operates within a voltage range of 1.283V to 1.45V, with typical operation at 1.35V, while maintaining backward compatibility with 1.5V DDR3 standards. It utilizes a 78-ball VFBGA package and is rated for an industrial temperature range of -40°C to 95°C.

Memory IC Feature Summary

Supports double data rate architecture with two data transfers per clock cycle.
Features programmable on-die termination for improved signal integrity.
Includes asynchronous reset functionality for power-up initialization.
Provides system-level timing calibration via write leveling and multi-purpose register.

Memory IC Applications

Industrial control systems
Automotive electronics
Communication equipment

Memory IC Procurement Notes

Verify the specific speed grade suffix '11I' corresponds to the required 933 MHz performance and industrial temperature rating. Confirm that the 78-ball VFBGA package dimensions match the target PCB layout. Ensure the design accounts for the 1.35V nominal supply voltage requirements and backward compatibility needs if interfacing with legacy 1.5V components.

Memory IC Selection Notes

Select this component when a high-density 2Gb memory solution is required for industrial environments. The 11I suffix indicates compliance with the DDR3L-1866 standard, suitable for applications needing up to 933 MHz operation. Consider the 78-ball VFBGA footprint for space-constrained designs requiring surface-mount installation.

Memory IC Part Context

This part belongs to the W632GU8NB series of DDR3L SDRAMs manufactured by Winbond Electronics. The series offers various speed grades and temperature ranges, with the '11I' variant specifically designed for industrial applications requiring robust performance across extended temperature conditions.