Memory IC W634GU6QB-11 product image

W634GU6QB-11

$4.88
  • Description:IC DRAM 4GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:3991fc3210b7 Category: Brand:

  
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W634GU6QB-11 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 4GBIT PAR 96VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W634GU6QB-11

  • Description:IC DRAM 4GBIT PAR 96VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3L
  • Memory Size:4Gbit
  • Memory Organization:256M x 16
  • Memory Interface:Parallel
  • Clock Frequency:933 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.283V ~ 1.45V
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:96-VFBGA
  • Supplier Device Package:96-VFBGA (7.5x13)
  • Access Time:20 ns

Memory IC datasheet and documents for W634GU6QB-11

W634GU6QB-11

Memory IC Overview

The W634GU6QB-11 is a 4Gbit DDR3L SDRAM organized as 32M x 8 banks x 16 bits. It supports speeds up to DDR3L-1866 with CL-13-13-13 timing. Operating voltage is 1.35V typical, backward compatible to 1.5V. It features an asynchronous reset, ZQ calibration, and programmable on-die termination. The device includes write leveling support and a Multi Purpose Register for system calibration.

Memory IC Feature Summary

  • Supports double data rate architecture with eight internal banks for concurrent operations.
  • Includes dynamic ODT mode and ZQ calibration for improved signal integrity.
  • Features a Multi Purpose Register (MPR) for reading predefined system timing calibration sequences.
  • Provides write leveling capability to optimize output driver impedance and data transmission stability.

Memory IC Applications

  • Industrial automation systems requiring wide temperature operation
  • Network communication equipment such as routers and switches
  • IoT devices needing low power consumption and high density

Memory IC Procurement Notes

Verify the specific speed grade suffix matches the required frequency bin. Confirm the package type corresponds to the design layout. Check RoHS compliance status for regulatory adherence. Ensure the operating temperature range aligns with the application environment requirements before finalizing procurement.

Memory IC Selection Notes

Select this component for applications requiring 16-bit width and industrial temperature ranges. Compare against other speed grades if higher frequencies are needed. Consider the VFBGA-96 package constraints during PCB layout. Evaluate power consumption specifications against system thermal limits.

Memory IC Part Context

This part belongs to Winbond's DDR3L SDRAM family designed for high-speed data processing. It complements lower density options like the W634GU6RB series. The device targets markets demanding reliable memory solutions in harsh environments. It serves as a key component in embedded systems and networking hardware.

Memory IC Replacement Considerations

W634GU6RB-11 offers similar electrical characteristics but may differ in packaging or availability status. Verify pin compatibility and timing parameters when substituting. Check manufacturer discontinuation notices for long-term supply assurance.

Memory IC FAQ

What is the maximum operating frequency for the -11 speed grade?

The -11 speed grade supports a maximum operating frequency of 933 MHz, compliant with the DDR3L-1866 specification.

Does the W634GU6QB-11 support DLL-off mode?

Yes, the device supports DLL-off mode, allowing operation without the Delay Locked Loop under specific conditions defined in the datasheet.

W634GU6QB-11W634GU6QB-11
$4.88
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