W638GU6QB12I

Memory IC Overview

The W638GU6QB12I is an 8 Gbit DDR3L SDRAM manufactured by Winbond Electronics. It features a 16-bit data bus width and supports a maximum clock frequency of 800 MHz. The device operates within a voltage range of 1.283 V to 1.45 V and utilizes a 96-pin VFBGA package. Memory organization is specified as 512 M x 16, with an access time of 225 ps. It is designed for surface mount installation and exhibits humidity sensitivity.

Memory IC Feature Summary

• Supports low-voltage operation compatible with DDR3L standards
• Provides high-density storage in a compact ball grid array package
• Enables high-speed data transfer through synchronous dynamic random access memory architecture

Memory IC Applications

• Industrial temperature embedded systems requiring volatile memory
• Consumer electronics utilizing surface mount technology
• General-purpose digital signal processing applications

Memory IC Procurement Notes

Verify the specific suffix and package type against official datasheets before procurement. Confirm current lifecycle status as some variants may be obsolete. Ensure compatibility with system voltage requirements and thermal specifications. Check for moisture sensitivity level handling procedures during assembly. Validate that the intended application environment matches the rated operating temperature range.

Memory IC Selection Notes

Select this component when an 8 Gbit capacity with a 16-bit interface is required. Consider the 96-VFBGA package constraints for PCB layout. Evaluate power consumption limits against system capabilities. Compare performance metrics with alternative DDR3L devices if higher speeds are needed. Ensure the design supports the necessary control signals for DRAM operation.

Memory IC Part Context

This part belongs to the Winbond W638GU6 series of DDR3L SDRAMs. It shares architectural similarities with other members of the family but differs in capacity and speed grades. The series targets applications needing reliable volatile memory in industrial or commercial environments. Packaging options vary across the series, including tray and reel configurations.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: None identified.