Memory IC W66BP6NBQAGJ TR product image

W66BP6NBQAGJ TR

$2.64
  • Description:IC DRAM 2GBIT LVSTL 11 200TFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:fcd2915e3d99 Category: Brand:

  
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W66BP6NBQAGJ TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 2GBIT LVSTL 11 200TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W66BP6NBQAGJ TR

  • Description:IC DRAM 2GBIT LVSTL 11 200TFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR4
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:LVSTL_11
  • Clock Frequency:1.867 GHz
  • Write Cycle Time - Word, Page:18ns
  • Voltage - Supply:1.06V ~ 1.17V, 1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 105°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:200-TFBGA
  • Supplier Device Package:200-TFBGA (10x14.5)
  • Access Time:3.6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W66BP6NBQAGJ TR

W66BP6NBQAGJ TR

Memory IC Overview

The Winbond W66BP6NBQAGJ TR is a 2 Gbit Low Power Double Data Rate 4 (LPDDR4) dynamic random-access memory IC. It features a 16-bit data bus width and operates at a maximum clock frequency of 1.6 GHz. The device is organized as 128 M x 16 bits. It supports a supply voltage range from 1.06 V to 1.95 V and functions within an operating temperature range of -40°C to +105°C. The component is housed in a WFBGA-200 package with surface mount installation style.

Memory IC Feature Summary

  • Supports LPDDR4 interface technology for mobile applications
  • Operates across extended industrial temperature ranges
  • Utilizes wide fine pitch ball grid array packaging

Memory IC Applications

  • Mobile electronic devices requiring high-speed volatile memory
  • Industrial control systems operating in extreme temperatures
  • Automotive infotainment and telematics units

Memory IC Procurement Notes

Verify current availability status directly with the manufacturer or authorized distributors, as this specific part number may be subject to production lifecycle changes. Confirm that the reel packaging format aligns with automated assembly requirements. Ensure compliance with RoHS directives and moisture sensitivity level classifications before procurement integration.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity with a 16-bit interface is required for LPDDR4 compliant designs. Consider the WFBGA-200 package dimensions for PCB layout constraints. Verify that the system power supply can maintain the specified voltage range under all load conditions to ensure stable operation within the industrial temperature spectrum.

Memory IC Part Context

This component belongs to the Winbond W66 series of mobile DRAM products. It is designed for high-performance computing tasks in portable and embedded systems. The LPDDR4 standard offers improved bandwidth efficiency compared to previous generations while maintaining low power consumption profiles suitable for battery-operated devices.

Memory IC Replacement Considerations

Consult official documentation for verified substitute part numbers within the same family. Cross-referencing pinouts and electrical specifications is essential when evaluating alternative components from other manufacturers.

W66BP6NBQAGJ TRW66BP6NBQAGJ TR
$2.64
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