W66CP2NQQAGJ TR

Memory IC Overview

The W66CP2NQQAGJ TR is a 4 Gbit Low Power Double Data Rate Type 4 (LPDDR4) dynamic random-access memory manufactured by Winbond. It features a Dual Die Package (DDP) configuration with a 32-bit data bus width and an organization of 128 M x 32. The component supports a maximum clock frequency of 1.866 GHz, resulting in a peak data rate of 3732 Mbps. It operates within a supply voltage range of 1.06 V to 1.95 V and is rated for industrial temperatures from -40°C to +105°C. The device is housed in a TFBGA-200 package and is supplied in tape and reel format.

Memory IC Feature Summary

• Dual Die Package (DDP) architecture integrating two memory dies into a single footprint for increased density.

Memory IC Applications

• Mobile computing platforms requiring high bandwidth and low power consumption.

Memory IC Procurement Notes

Verify the current lifecycle status directly with Winbond Electronics or authorized distributors, as availability may be restricted. Confirm that the TFBGA-200 package dimensions and pinout match the target PCB design. Ensure compliance with humidity sensitivity level requirements during storage and soldering processes to prevent moisture-induced damage.

Memory IC Selection Notes

Select this component when a 4 Gbit capacity is required in a compact form factor using LPDDR4 technology. The DDP structure allows for higher density without increasing the board footprint compared to single-die solutions. Verify compatibility with the system controller's support for LPDDR4 standards and the specific 1.866 GHz speed grade.

Memory IC Part Context

This part belongs to the Winbond W66 series of LPDDR4 DRAMs, designed for mobile and embedded applications. The 'TR' suffix indicates the component is packaged in a tape and reel for automated surface-mount assembly. The W66 series generally targets devices needing efficient power management and high-speed data transfer capabilities.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Cross-referencing requires matching the LPDDR4 standard, 4 Gbit capacity, 32-bit width, TFBGA-200 package, and temperature range with other manufacturers.