W66DP2RQQAFJ TR

Memory IC Overview

The W66DP2RQQAFJ TR is a dynamic random access memory component manufactured by Winbond Electronics. It implements LPDDR4/4X technology with an 8Gb capacity and a 256M x 32 organization. The device operates at a clock frequency of 1600MHz and features LVSTL_06 interface compatibility. It supports dual data rate (DDP) functionality within a 200-TFBGA package measuring 10x14.5mm. Electrical specifications include a supply voltage range of 1.06V to 1.17V and 1.7V to 1.95V, with an access time of 3.5ns. The unit is rated for operation between -40°C and 105°C.

Memory IC Feature Summary

• Supports LPDDR4 and LPDDR4X standards with dual data rate capability
• Integrates 8Gb storage capacity in a compact surface-mount package
• Operates across extended industrial temperature ranges

Memory IC Applications

• Mobile electronic devices requiring high-density volatile memory
• Industrial control systems operating in extreme temperatures
• Embedded computing platforms utilizing LPDDR interfaces

Memory IC Procurement Notes

Verify current manufacturing status directly with Winbond Electronics before procurement planning. Confirm specific packaging requirements, as the suffix indicates tape-and-reel configuration. Ensure design compatibility with the 200-TFBGA footprint and LVSTL_06 signaling standards. Cross-reference datasheet revisions to account for potential material changes documented in recent product change notifications.

Memory IC Selection Notes

Select this component when designing systems requiring 8Gb density with LPDDR4X support. Verify that the host controller supports the 1600MHz clock speed and DDP architecture. Ensure power delivery circuits accommodate the specified voltage rails. Confirm thermal management strategies align with the 105°C maximum junction temperature rating for reliable long-term operation.

Memory IC Part Context

This part belongs to Winbond's mobile DRAM portfolio, specifically designed for advanced low-power applications. It utilizes TFBGA packaging to minimize board space while maintaining signal integrity. The series supports various organizational configurations to meet diverse bandwidth and capacity requirements in modern portable electronics.

Memory IC Replacement Considerations

W66DP2RQQAGJ TR serves as a parametric equivalent with identical physical dimensions and pinout but operates at a higher 1866MHz frequency. Verify system timing constraints before substitution.