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W947D2HKZ-6G is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 128MBIT PAR 90VFBGA. Review the specifications below when checking this part for your BOM.
The W947D2HKZ-6G is a mobile LPDDR SDRAM integrated circuit manufactured by Winbond Electronics. It provides a total storage capacity of 128 Mbit, organized as 4 Meg x 32 bits. The device supports a maximum clock frequency of 166 MHz and utilizes a 65nm process technology. It operates within a supply voltage range of 1.7 V to 1.95 V. The component is housed in a 90-ball VFBGA package and is rated for an operating temperature range from -25°C to +85°C.
Verify the specific suffix (e.g., TR) for tape-and-reel packaging requirements if applicable. Confirm RoHS compliance status with the manufacturer or authorized distributor. Ensure the lead-free designation matches project specifications. Check current availability as product lifecycles may affect procurement options.
Select this component when a 128 Mbit density with a 32-bit bus width is required for mobile applications. Consider the 166 MHz speed grade and 65nm process for performance needs. Verify that the -25°C to +85°C industrial temperature range meets environmental constraints. Ensure the VFBGA-90 footprint aligns with the PCB layout design.
This part belongs to Winbond's mobile LPDDR series, designed for embedded and portable markets. It complements other DRAM offerings like the W948D6KBHX5I, which offers higher density but different pin counts. The series focuses on balancing power efficiency with performance for consumer electronics.
Public confirmed substitute part numbers are not available in the provided documentation. Consult official Winbond resources for qualified alternatives.
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