Memory IC W947D2HKZ-6G product image

W947D2HKZ-6G

  • Description:IC DRAM 128MBIT PAR 90VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:937099defa76 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

W947D2HKZ-6G is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 128MBIT PAR 90VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W947D2HKZ-6G

  • Description:IC DRAM 128MBIT PAR 90VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:-
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR
  • Memory Size:128Mbit
  • Memory Organization:4M x 32
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Access Time:-

Memory IC datasheet and documents for W947D2HKZ-6G

W947D2HKZ-6G

Memory IC Overview

The W947D2HKZ-6G is a mobile LPDDR SDRAM integrated circuit manufactured by Winbond Electronics. It provides a total storage capacity of 128 Mbit, organized as 4 Meg x 32 bits. The device supports a maximum clock frequency of 166 MHz and utilizes a 65nm process technology. It operates within a supply voltage range of 1.7 V to 1.95 V. The component is housed in a 90-ball VFBGA package and is rated for an operating temperature range from -25°C to +85°C.

Memory IC Feature Summary

  • Mobile LPDDR architecture optimized for low power consumption in portable devices
  • High-speed parallel data interface supporting up to 166 MHz clock rates
  • Compact 90-ball VFBGA package design suitable for space-constrained applications

Memory IC Applications

  • Smartphones and mobile communication devices
  • Portable media players and handheld electronics
  • Embedded systems requiring low-power memory solutions

Memory IC Procurement Notes

Verify the specific suffix (e.g., TR) for tape-and-reel packaging requirements if applicable. Confirm RoHS compliance status with the manufacturer or authorized distributor. Ensure the lead-free designation matches project specifications. Check current availability as product lifecycles may affect procurement options.

Memory IC Selection Notes

Select this component when a 128 Mbit density with a 32-bit bus width is required for mobile applications. Consider the 166 MHz speed grade and 65nm process for performance needs. Verify that the -25°C to +85°C industrial temperature range meets environmental constraints. Ensure the VFBGA-90 footprint aligns with the PCB layout design.

Memory IC Part Context

This part belongs to Winbond's mobile LPDDR series, designed for embedded and portable markets. It complements other DRAM offerings like the W948D6KBHX5I, which offers higher density but different pin counts. The series focuses on balancing power efficiency with performance for consumer electronics.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Winbond resources for qualified alternatives.

W947D2HKZ-6GW947D2HKZ-6G

Click on the inquiry