Memory IC W948D6FBHX5E TR product image

W948D6FBHX5E TR

  • Description:IC DRAM 256MBIT PAR 60VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:f030263a27bf Category: Brand:

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W948D6FBHX5E TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 256MBIT PAR 60VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W948D6FBHX5E TR

  • Description:IC DRAM 256MBIT PAR 60VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR
  • Memory Size:256Mbit
  • Memory Organization:16M x 16
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-25°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:60-TFBGA
  • Supplier Device Package:60-VFBGA (8x9)
  • Access Time:5 ns

Memory IC datasheet and documents for W948D6FBHX5E TR

W948D6FBHX5E TR

Memory IC Overview

The W948D6FBHX5E TR is a 256Mb Mobile LPDDR SDRAM manufactured by Winbond Electronics. It features a 16-bit data bus width and supports a maximum clock frequency of 200 MHz. The device operates within a voltage range of 1.7 V to 1.95 V for both VDD and VDDQ. It utilizes a 60-ball VFBGA package with an industrial temperature rating spanning from -40°C to +85°C.

Memory IC Feature Summary

  • Supports Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR) for power management.
  • Features four internal banks enabling concurrent operation and interleaving to hide pre-charging time.
  • Includes programmable output buffer driver strength and Data Mask (DM) functionality for write data control.

Memory IC Applications

  • Mobile handheld devices requiring low-power memory solutions
  • Industrial embedded systems operating in extreme temperatures
  • Portable consumer electronics utilizing mobile LPDDR interfaces

Memory IC Procurement Notes

Verify the specific suffix 'X5E' against official datasheets to confirm the 200MHz speed grade and Industrial temperature range (-40°C to +85°C). Ensure compatibility with the 60-ball VFBGA footprint during procurement, as this variant differs from other density or package options within the W948D6 family.

Memory IC Selection Notes

Select this component when a 16-bit interface is required for 256Mb capacity in mobile applications. Confirm that the system design accommodates the 1.7V to 1.95V supply requirements. Verify that the host controller supports the necessary initialization sequence, including Mode Register Set commands, before deployment.

Memory IC Part Context

This part belongs to the W948D6FB series of Mobile LPDDR SDRAMs. It shares architectural similarities with the x32 variants but provides a narrower 16-bit data path. The device is designed for high-density storage in space-constrained mobile environments while maintaining low standby power consumption through advanced power-down modes.

Memory IC Replacement Considerations

Check for updated revisions within the W948D6FB series. Verify pinout compatibility if substituting with other 60-ball VFBGA LPDDR parts. Ensure the replacement supports the same 200MHz clock rate and industrial temperature specifications.

W948D6FBHX5E TRW948D6FBHX5E TR

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