Memory IC W948D6FBHX6I TR product image

W948D6FBHX6I TR

  • Description:IC DRAM 256MBIT PARALLEL 60VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)

SKU:6aa2fdf30978 Category: Brand:

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W948D6FBHX6I TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 256MBIT PARALLEL 60VFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W948D6FBHX6I TR

  • Description:IC DRAM 256MBIT PARALLEL 60VFBGA
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tape & Reel (TR)
  • Memory Type:-
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR
  • Memory Size:256Mbit
  • Memory Organization:16M x 16
  • Memory Interface:Parallel
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:60-TFBGA
  • Supplier Device Package:60-VFBGA (8x9)
  • Access Time:-

Memory IC datasheet and documents for W948D6FBHX6I TR

W948D6FBHX6I TR

Memory IC Overview

The W948D6FBHX6I TR is a mobile LPDDR SDRAM integrated circuit manufactured by Winbond Electronics. It provides a storage capacity of 256 Mbit, organized as 16 Meg x 16 bits. The device supports a maximum clock frequency of 166 MHz with a typical access time of 5 ns. It operates within a supply voltage range of 1.7 V to 1.95 V and is rated for an industrial temperature range of -40°C to +85°C. The component is housed in a 60-pin VFBGA package (8x9 mm) and is supplied in tape and reel packaging.

Memory IC Feature Summary

  • Mobile LPDDR architecture optimized for low power consumption in portable devices
  • Parallel memory interface supporting high-speed data transfer at 166 MHz
  • Industrial temperature rating ensuring reliable operation in harsh environments
  • Compact 60-pin VFBGA surface-mount package design

Memory IC Applications

  • Portable consumer electronics requiring low-power memory solutions
  • Industrial control systems operating in extreme temperatures
  • Embedded computing platforms utilizing mobile DRAM interfaces
  • Handheld devices and mobile communication equipment

Memory IC Procurement Notes

Verify the exact suffix configuration against official Winbond documentation before procurement, as minor variations may affect electrical characteristics or packaging. Confirm current availability status, as this component may be subject to discontinuation notices. Ensure compatibility with existing board layouts regarding the 60-VFBGA footprint and moisture sensitivity levels during assembly processes.

Memory IC Selection Notes

Select this component when a 256 Mbit mobile LPDDR solution is required with specific 16-bit bus width constraints. Consider the 166 MHz speed grade and industrial temperature range (-40°C to +85°C) for applications exceeding standard commercial limits. Evaluate the 60-VFBGA package dimensions against available PCB space and ensure the system supports the 1.7V to 1.95V operating voltage range for proper power management.

Memory IC Part Context

This part belongs to the Winbond W948D6 series of mobile LPDDR SDRAMs. It shares architectural similarities with other variants in the family but differs in speed grade, temperature rating, and packaging options. The 'TR' suffix indicates tape and reel delivery, distinguishing it from tray-packaged equivalents like the W948D6FBHX6I.

Memory IC Replacement Considerations

Potential substitutes include W948D6KBHX6I TR or W948D6FBHX5I TR, provided they match the required speed grade and temperature specifications. Verify pinout compatibility and electrical parameters before substitution.

W948D6FBHX6I TRW948D6FBHX6I TR

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