W958D6DBCX7I

Memory IC Overview

The Winbond W958D6DBCX7I is a 256Mb CMOS pseudo-static random access memory featuring a 16-bit multiplexed address/data bus. It operates within a voltage range of 1.7V to 1.95V for both VCC and VCCQ. The device supports asynchronous, page, and burst operations with a maximum clock rate of 133 MHz and a random access time of 70ns. It is housed in a 54-ball VFBGA package and functions across an operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Supports asynchronous, page, and burst operations via a 16-bit multiplexed address/data bus.
• Incorporates transparent self-refresh mechanisms including partial-array refresh and temperature-compensated refresh.
• Features configurable bus and refresh registers for system integration flexibility.
• Includes deep power-down mode to minimize standby current consumption.

Memory IC Applications

• Low-power portable applications
• Wireless devices requiring low standby current
• Systems utilizing industry-standard CellularRAM 1.5 x16 A/D MUX interfaces

Memory IC Procurement Notes

Verify the specific ordering suffix CX7I against the manufacturer's official documentation to confirm the exact package type (54 Ball VFBGA) and temperature grade (-40°C to +85°C). Ensure that the required voltage levels align with the specified 1.7V–1.95V range for both VCC and VCCQ before procurement.

Memory IC Selection Notes

Select this component when a high-density alternative to SRAM or Pseudo SRAM is needed for low-power portable applications. It is suitable for designs requiring a multiplexed address/data bus to reduce signal count while maintaining high bandwidth. Ensure the system controller can support the required asynchronous or burst mode configurations defined by the Bus Configuration Register.

Memory IC Part Context

This part belongs to the Winbond W958D6DB series of ADMUX PSRAM products. These devices are designed as high-speed, CMOS pseudo-static random access memories. They utilize a DRAM core organized to provide high density while mimicking Flash control interfaces for seamless integration into existing systems.

Memory IC Replacement Considerations

No public confirmed substitute part numbers are available in the provided source material.