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W968D6DAGX7I TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC PSRAM 256MBIT PAR 54VFBGA. Review the specifications below when checking this part for your BOM.
The Winbond W968D6DAGX7I TR is a 256Mb CellularRAM device featuring a 16-bit data bus width and organized as 16M x 16. It operates with VCC and VCCQ supply voltages ranging from 1.7V to 1.95V. The maximum clock rate is 133 MHz, supporting random access times of 70ns. Page mode intrapage read access is 20ns, while interpage access is 70ns. Active current consumption is less than 25mA at 85°C, with standby current at 400μA max and deep power-down typical at 25μA. Operating temperature range spans -40°C to +85°C.
Verify the specific ordering suffix against official documentation to confirm package type and temperature grade. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Ensure voltage requirements align with system design specifications for both core and I/O supplies.
Select this component when high-speed burst access is required alongside low-power standby characteristics. The device serves as a high-density alternative to standard SRAM or Pseudo SRAM. Consider the integrated self-refresh capability if minimizing external control logic complexity is a priority.
This part belongs to the Winbond CellularRAM family, designed to bridge the performance gap between DRAM density and SRAM speed. It utilizes a DRAM core with an interface compatible with burst-mode Flash standards, enabling direct replacement in many legacy designs without significant board layout changes.
Check pinout compatibility with existing designs. Verify that the target system supports the required 1.8V I/O levels and 133 MHz clock speeds.
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