Memory IC W979H2KBQX2I product image

W979H2KBQX2I

  • Description:IC DRAM 512MBIT 168
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray

SKU:6537a18b3e49 Category: Brand:

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W979H2KBQX2I is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 512MBIT 168. Review the specifications below when checking this part for your BOM.

Memory IC specifications for W979H2KBQX2I

  • Description:IC DRAM 512MBIT 168
  • Series:-
  • Mfr:Winbond Electronics
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile LPDDR2
  • Memory Size:512Mbit
  • Memory Organization:16M x 32
  • Memory Interface:-
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.14V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:168-WFBGA
  • Supplier Device Package:168-WFBGA (12x12)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for W979H2KBQX2I

W979H2KBQX2I

Memory IC Overview

The W979H2KBQX2I is a 512Mb LPDDR2 SDRAM manufactured by Winbond Electronics. It features a 32-bit data bus width and an internal organization of 16M x 32. The device supports a maximum clock frequency of 533MHz and operates within a supply voltage range of 1.14V to 1.95V. It is housed in a 168-ball WFBGA package and is rated for commercial temperature operation from -25°C to +85°C.

Memory IC Feature Summary

  • Supports LPDDR2-S4B interface with differential clock and data strobe inputs for high-speed signal integrity.
  • Includes ZQ calibration functionality to dynamically adjust output driver impedance for signal quality optimization.
  • Features partial array self-refresh capability allowing selective bank masking to reduce standby power consumption.

Memory IC Applications

  • Mobile handheld devices requiring low-power memory solutions
  • Embedded systems with strict space constraints
  • Industrial control modules operating in commercial temperature ranges

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm pinout compatibility, package dimensions, and electrical specifications. Ensure that the selected variant matches the required thermal rating and interface timing parameters for the target application design.

Memory IC Selection Notes

Select this component based on the requirement for a 512Mb capacity with a 32-bit data path. Confirm that the system controller supports LPDDR2 initialization sequences and that the PCB layout accommodates the 168-ball WFBGA footprint. Validate that the operating environment remains within the specified -25°C to +85°C range.

Memory IC Part Context

This part belongs to the W979H2KB series of mobile LPDDR2 SDRAMs designed for portable electronics. It utilizes advanced process technology to achieve high bandwidth while maintaining low power consumption. The series is optimized for applications where board space and energy efficiency are critical design factors.

Memory IC Replacement Considerations

Consult the manufacturer's obsolescence notices or cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pin configuration, voltage levels, and timing parameters to guarantee functional compatibility without hardware redesign.

Memory IC FAQ

What is the internal organization of the W979H2KBQX2I?

The device has an internal organization of 16M x 32 bits.

Does the W979H2KBQX2I support differential signaling?

Yes, it supports differential clock (CK_t/CK_c) and data strobe (DQS_t/DQS_c) inputs as per the LPDDR2 standard.

W979H2KBQX2IW979H2KBQX2I

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